Inventor · disambiguated record
Jihye Shim
Also filed as: SHIM JIHYE
5 granted patents·20 pending applications·13 citations·filing 2013–2025
72Inventor score
Top patents by PatentIndex Score
25 records- 0186US10903442B2Organic light-emitting diode comprising self-crystallizing material and organic light-emitting display device including the sameSAMSUNG DISPLAY CO LTD·Filed 2018·Granted Jan 26, 2021·5 cites·18 claims
- 0279US9806296B2Organic light emitting diode deviceSAMSUNG DISPLAY CO LTD·Filed 2015·Granted Oct 31, 2017·4 cites·17 claims
- 0372US11283038B2Light-emitting deviceSAMSUNG DISPLAY CO LTD·Filed 2018·Granted Mar 22, 2022·1 cites·20 claims
- 0471US9246119B2Organic electroluminescent device and manufacturing method thereofSAMSUNG DISPLAY CO LTD·Filed 2013·Granted Jan 26, 2016·3 cites·10 claims
- 0560US2025210400A1Carrier substrate and method of manufacturing semiconductor package by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0658US2025132202A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0758US2025125205A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0857US2025201749A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0957US2025118639A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1056US2025140727A1Wiring structure, semiconductor package comprising the same, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1156US2025105133A1Semiconductor package including insulating materialSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1256US2025167153A1Method of forming redistribution pad and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1355US2024234165A9Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1455US2024222251A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1554US2024194553A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1653US2024145361A1Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1752US2024194582A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1852US2024136332A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1951US2025226283A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2050US12431479B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 2148US2024266188A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2247US2025069899A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2345US2024203813A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2437US2025246475A1Carrier substrate and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2537US2019148648A1Organic light-emitting diode and organic light-emitting display device including the sameSAMSUNG DISPLAY CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →