Inventor · disambiguated record
Jiwon Shin
Also filed as: SHIN JIWON
11 granted patents·13 pending applications·9 citations·filing 2013–2025
81Inventor score
Files withSAMSUNG ELECTRONICS CO LTD18LG ELECTRONICS INC2MACROGEN INC2FAIRY INC1SEOUL NAT UNIV R&DB FOUNDATION1
Top patents by PatentIndex Score
24 records- 0187US11676904B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0286US10872875B2Bonding head and method for bonding semiconductor package, and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 22, 2020·7 cites·19 claims
- 0374US2025372500A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0471US12272652B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 0570US2025210533A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0662US12406917B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·10 claims
- 0760US2025183219A1Semiconductor packages with chip stackSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0858US2025336827A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0957US2025246573A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1056US2025316640A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1155US12489450B2Injection-locked clock multiplier and its operation thereofSEOUL NAT UNIV R&DB FOUNDATION·Filed 2024·Granted Dec 2, 2025·0 cites·12 claims
- 1255US2025118565A1Method of manufacturing semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1354US10906217B2Molding for high brightness appearance and molding method thereofLG ELECTRONICS INC·Filed 2017·Granted Feb 2, 2021·0 cites·10 claims
- 1454US2025192094A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1554US2025379180A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1654US2025239554A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1748US12288745B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·20 claims
- 1848US11781132B2DNA extraction method using microwave for next generation sequencing and use thereofMACROGEN INC·Filed 2020·Granted Oct 10, 2023·0 cites·6 claims
- 1948US11749592B2Package-on-package type semiconductor package including a lower semiconductor package and an upper semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 2048US2013344275A1Decoration film having mirror effectLG ELECTRONICS INC·Filed 2013·Application pending·0 cites
- 2147US12463122B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 2247US2024259476A1Method, user device, and computer program for determining property of service executed in user device based on packet analysisFAIRY INC·Filed 2023·Application pending·0 cites
- 2346US2023132054A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2439US11004544B2Method of providing biological data, method of encrypting biological data, and method of processing biological dataMACROGEN INC·Filed 2020·Granted May 11, 2021·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →