Inventor · disambiguated record
Jimmy Siat
Also filed as: SIAT JIMMY
1 granted patent·2 pending applications·0 citations·filing 2007–2009
5Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0137US2009165815A1Avoiding electrical shorts in packagingUNITED TEST & ASSEMBLY CT LTD·Filed 2008·Application pending·0 cites
- 0232US2009008796A1Copper on organic solderability preservative (osp) interconnectUNITED TEST & ASSEMBLY CT LTD·Filed 2007·Application pending·0 cites
- 0327US8247272B2Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding processKOH YONG CHUAN·Filed 2009·Granted Aug 21, 2012·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →