Inventor · disambiguated record
Jiun Hann Sir
Also filed as: SIR JIUN H · SIR JIUN HANN
33 granted patents·21 pending applications·141 citations·filing 2003–2025
96Inventor score
Top patents by PatentIndex Score
54 records- 0196US9972589B1Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layerINTEL CORP·Filed 2017·Granted May 15, 2018·47 cites·22 claims
- 0294US10515912B2Integrated circuit packagesINTEL CORP·Filed 2017·Granted Dec 24, 2019·37 cites·25 claims
- 0389US2025336810A1Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2025·Application pending·0 cites
- 0487US11205613B2Organic mold interconnects in shielded interconnects frames for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Dec 21, 2021·2 cites·23 claims
- 0586US10796999B2Floating-bridge interconnects and methods of assembling sameINTEL CORP·Filed 2019·Granted Oct 6, 2020·4 cites·18 claims
- 0683US12400952B2Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 0781US11538633B2Combination stiffener and capacitorINTEL CORP·Filed 2016·Granted Dec 27, 2022·3 cites·17 claims
- 0880US9778688B2Flexible system-in-package solutions for wearable devicesINTEL CORP·Filed 2014·Granted Oct 3, 2017·5 cites·24 claims
- 0977US11908793B2Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2022·Granted Feb 20, 2024·0 cites·22 claims
- 1075US10998262B2Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2019·Granted May 4, 2021·1 cites·23 claims
- 1175US7745912B2Stress absorption layer and cylinder solder joint method and apparatusINTEL CORP·Filed 2005·Granted Jun 29, 2010·6 cites·18 claims
- 1273US11658111B2Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 1373US6946737B2Robust interlocking viaINTEL CORP·Filed 2004·Granted Sep 20, 2005·14 cites·9 claims
- 1472US7678616B2Thermal management method including a metallic layer directly on an integrated heat spreader and integrated circuitINTEL CORP·Filed 2008·Granted Mar 16, 2010·5 cites·9 claims
- 1571US11658127B2RFI free picture frame metal stiffenerINTEL CORP·Filed 2019·Granted May 23, 2023·1 cites·28 claims
- 1669US11699644B2Organic mold interconnects in shielded interconnects frames for integrated-circuit packagesINTEL CORP·Filed 2021·Granted Jul 11, 2023·0 cites·16 claims
- 1769US11264315B2Electronic package with passive component between substratesINTEL CORP·Filed 2017·Granted Mar 1, 2022·1 cites·11 claims
- 1867US11929295B2Multi-use package architectureINTEL CORP·Filed 2022·Granted Mar 12, 2024·0 cites·14 claims
- 1967US11823994B2Systems and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate packageINTEL CORP·Filed 2022·Granted Nov 21, 2023·0 cites·16 claims
- 2066US11393760B2Floating-bridge interconnects and methods of assembling sameINTEL CORP·Filed 2020·Granted Jul 19, 2022·0 cites·19 claims
- 2165US12500155B2Electronic package with passive component between substratesINTEL CORP·Filed 2022·Granted Dec 16, 2025·0 cites·16 claims
- 2265US7795736B2Interconnects with interlocksINTEL CORP·Filed 2007·Granted Sep 14, 2010·2 cites·18 claims
- 2365US7439618B2Integrated circuit thermal management method and apparatusINTEL CORP·Filed 2005·Granted Oct 21, 2008·3 cites·14 claims
- 2463US10256213B2Reduced-height electronic memory system and methodINTEL CORP·Filed 2015·Granted Apr 9, 2019·1 cites·13 claims
- 2560US7217651B2Interconnects with interlocksINTEL CORP·Filed 2004·Granted May 15, 2007·6 cites·18 claims
- 2657US2025096154A1Package Substrates with Stiffener InterposersINTEL CORP·Filed 2023·Application pending·0 cites
- 2755US2025006666A1Microstrip routing on embedded high-k dielectricINTEL CORP·Filed 2023·Application pending·0 cites
- 2855US2024355792A1Reversed overhang memory on package (mop) architectureINTEL CORP·Filed 2023·Application pending·0 cites
- 2955US2025107003A1Methods and apparatus to manage noise for timing circuitryINTEL CORP·Filed 2023·Application pending·0 cites
- 3055US2025006588A1Passive cooling heat spreader with phase change material infused meshINTEL CORP·Filed 2023·Application pending·0 cites
- 3154US2025113428A1Technologies for an electromagnetic interference shieldINTEL CORP·Filed 2023·Application pending·0 cites
- 3253US2024290680A1Low-profile memory apparatus compatible with system thermal solutions and method for making sameINTEL CORP·Filed 2023·Application pending·0 cites
- 3353US2024106139A1Connector to electrically couple multiple substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 3453US2024113033A1Dynamic random-access memory in a molding beneath a dieINTEL CORP·Filed 2022·Application pending·0 cites
- 3552US2024145394A1Interposer power corridorINTEL CORP·Filed 2022·Application pending·0 cites
- 3651US11322434B2Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packagesINTEL CORP·Filed 2020·Granted May 3, 2022·0 cites·23 claims
- 3751US11289414B2Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate packageINTEL CORP·Filed 2017·Granted Mar 29, 2022·0 cites·16 claims
- 3851US2024071948A1Semiconductor package with stiffener basket portionINTEL CORP·Filed 2022·Application pending·0 cites
- 3951US2023369232A1Molded interconnect memory on packageINTEL CORP·Filed 2022·Application pending·0 cites
- 4051US2023397323A1Package bottom side thermal solution with discrete hat-shaped copper spreader componentINTEL CORP·Filed 2022·Application pending·0 cites
- 4150US7365007B2Interconnects with direct metalization and conductive polymerINTEL CORP·Filed 2004·Granted Apr 29, 2008·3 cites·16 claims
- 4249US2019287872A1Multi-use package architectureINTEL CORP·Filed 2018·Application pending·0 cites
- 4348US11264160B2Extended package air core inductorINTEL CORP·Filed 2019·Granted Mar 1, 2022·0 cites·19 claims
- 4447US2011147923A1Surface Mounting Integrated Circuit ComponentsSIR JIUN HANN·Filed 2009·Application pending·0 cites
- 4547US2023395524A1Emi cage for microstrip routing via dual layer underfill conceptINTEL CORP·Filed 2022·Application pending·0 cites
- 4646US10163777B2Interconnects for semiconductor packagesINTEL CORP·Filed 2017·Granted Dec 25, 2018·0 cites·14 claims
- 4745US9960224B2Three capacitor stack and associated methodsINTEL CORP·Filed 2016·Granted May 1, 2018·0 cites·25 claims
- 4843US10609813B2Capacitive interconnect in a semiconductor packageINTEL CORP·Filed 2016·Granted Mar 31, 2020·0 cites·22 claims
- 4942US10923415B2Semiconductor package having integrated stiffener regionINTEL CORP·Filed 2016·Granted Feb 16, 2021·0 cites·18 claims
- 5041US11587844B2Electronic device package on package (POP)INTEL CORP·Filed 2016·Granted Feb 21, 2023·0 cites·19 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →