Inventor · disambiguated record
Jik-Ho Song
Also filed as: SONG JIK-HO
2 granted patents·7 citations·filing 2011–2015
52Inventor score
Technology areasH05K
Top patents by PatentIndex Score
2 records- 0181US9502341B2Printed circuit board and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 22, 2016·4 cites·14 claims
- 0261US9030021B2Printed circuit board having hexagonally aligned bump pads for substrate of semiconductor package, and semiconductor package including the sameSONG JIK-HO·Filed 2011·Granted May 12, 2015·3 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →