Inventor · disambiguated record
Jiwei Sun
Also filed as: SUN JIWEI
21 granted patents·8 pending applications·35 citations·filing 2012–2023
91Inventor score
Files withINTEL CORP15CORNING CABLE SYSTEMS SHANGHAI CO LTD2ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG2ROSENBERGER SHANGHAI TECH CO LTD2UNION HOSPITAL TONGJI MEDICAL COLLEGE HUAZHONG UNIV OF SCIENCE AND TECHNOLOGY2
Top patents by PatentIndex Score
29 records- 0193US11664596B2Antenna modules and communication devicesINTEL CORP·Filed 2021·Granted May 30, 2023·2 cites·20 claims
- 0293US10797394B2Antenna modules and communication devicesINTEL CORP·Filed 2018·Granted Oct 6, 2020·8 cites·25 claims
- 0392US11715889B2Slow wave structure for millimeter wave antennasINTEL CORP·Filed 2021·Granted Aug 1, 2023·2 cites·30 claims
- 0486US8459880B2Fiber optic connectors, cable assemblies and methods for making the sameCASTONGUAY GUY J·Filed 2012·Granted Jun 11, 2013·13 cites·43 claims
- 0581US11121468B2Antenna modules and communication devicesINTEL CORP·Filed 2020·Granted Sep 14, 2021·1 cites·20 claims
- 0674US9285543B2Fiber optic connectors, cable assemblies, and method for making the sameCORNING CABLE SYSTEMS SHANGHAI CO LTD·Filed 2013·Granted Mar 15, 2016·4 cites·29 claims
- 0771US11095045B2Slow wave structure for millimeter wave antennasINTEL CORP·Filed 2017·Granted Aug 17, 2021·1 cites·30 claims
- 0871US9464994B2High sensitivity tunable radio frequency sensorsUNIV CLEMSON·Filed 2014·Granted Oct 11, 2016·2 cites·17 claims
- 0970US12288744B2Microelectronic assemblies having conductive structures with different thicknesses on a core substrateINTEL CORP·Filed 2022·Granted Apr 29, 2025·0 cites·11 claims
- 1061US9423586B2Fiber optic connectors, cable assemblies and method for making the sameCORNING CABLE SYSTEMS (SHANGHAI) CO LTD·Filed 2014·Granted Aug 23, 2016·2 cites·22 claims
- 1159US12347788B2Glass substrates having signal shielding for use with semiconductor packages and related methodsINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·20 claims
- 1256US12287544B2Display apparatusBOE MLED TECHNOLOGY CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·15 claims
- 1355US11380609B2Microelectronic assemblies having conductive structures with different thicknesses on a core substrateINTEL CORP·Filed 2018·Granted Jul 5, 2022·0 cites·20 claims
- 1453US12235541B2Backlight module, method for manufacturing the same, and display apparatusHEFEI BOE RUISHENG TECH CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 1553US12019296B2Optical fiber terminal boxROSENBERGER SHANGHAI TECH CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·12 claims
- 1653US2024006289A1Low insertion loss coaxial through-hole for highspeed input-ouputINTEL CORP·Filed 2022·Application pending·0 cites
- 1753US2024173104A1Micro-magnetic integrated orthodontic bracket, flexible magnetic patch and preparation method thereofUNION HOSPITAL TONGJI MEDICAL COLLEGE HUAZHONG UNIV OF SCIENCE AND TECHNOLOGY·Filed 2023·Application pending·0 cites
- 1853US2024006323A1Interconnect bridge with similar channel lengthsINTEL CORP·Filed 2022·Application pending·0 cites
- 1952US12228817B2Display device and control method thereforFUZHOU BOE OPTOELECTRONICS TECH CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·19 claims
- 2050US2024105577A1Methods, systems, apparatus, and articles of manufacture to produce integrated circuit packages with grounding membersINTEL CORP·Filed 2022·Application pending·0 cites
- 2149US12239503B2Magnetic-field-adjustable micromagnetic orthodontic acceleratorUNION HOSPITAL TONGJI MEDICAL COLLEGE HUAZHONG UNIV OF SCIENCE AND TECHNOLOGY·Filed 2023·Granted Mar 4, 2025·0 cites·3 claims
- 2249US2023088928A1Embedded glass cores in package substrates and related methodsINTEL CORP·Filed 2021·Application pending·0 cites
- 2346US2023420298A1Multi-pathway routing via through holeINTEL CORP·Filed 2022·Application pending·0 cites
- 2445US12009320B2Interconnect loss of high density package with magnetic materialINTEL CORP·Filed 2019·Granted Jun 11, 2024·0 cites·12 claims
- 2543US11482471B2Thermal management solutions for integrated circuit packagesINTEL CORP·Filed 2019·Granted Oct 25, 2022·0 cites·18 claims
- 2640US2012180298A1Termination tool and methods thereforCASTONGUAY GUY JOACHIN·Filed 2012·Application pending·0 cites
- 2737US11796752B2Fiber optic module, fiber optic module kit, and optical patch panelROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2021·Granted Oct 24, 2023·0 cites·17 claims
- 2835US2021116662A1Patch Panel and Distribution FrameROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG·Filed 2020·Application pending·0 cites
- 2932US10566731B1Outdoor waterproof connector boxROSENBERGER SHANGHAI TECH CO LTD·Filed 2019·Granted Feb 18, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →