Inventor · disambiguated record
Jih-Churng Twu
Also filed as: TWU JIH-CHURNG
39 granted patents·14 pending applications·860 citations·filing 1998–2024
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG33TAIWAN SEMICONDUCTOR MFG CO LTD18TAIWAN SEMICONDCUTOR MFG COMPA1TAIWAN SEMICONDUCTORS MFG CO L1
Top patents by PatentIndex Score
53 records- 0190US6753249B1Multilayer interface in copper CMP for low K dielectricTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 22, 2004·64 cites·57 claims
- 0289US6197669B1Reduction of surface defects on amorphous silicon grown by a low-temperature, high pressure LPCVD processTAIWAN SEMICONDCUTOR MFG COMPA·Filed 1999·Granted Mar 6, 2001·102 cites·15 claims
- 0387US6429118B1Elimination of electrochemical deposition copper line damage for damascene processingTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Aug 6, 2002·40 cites·37 claims
- 0487US6197701B1Lightly nitridation surface for preparing thin-gate oxidesTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Mar 6, 2001·90 cites·13 claims
- 0586US6391780B1Method to prevent copper CMP dishingTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted May 21, 2002·78 cites·20 claims
- 0685US11804392B2Method of monitoring toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 31, 2023·1 cites·20 claims
- 0784US6380056B1Lightly nitridation surface for preparing thin-gate oxidesTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Apr 30, 2002·75 cites·40 claims
- 0883US11239099B2Tool monitoring device and method of monitoring toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 1, 2022·3 cites·20 claims
- 0980US6162716AAmorphous silicon gate with mismatched grain-boundary microstructureTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Dec 19, 2000·44 cites·15 claims
- 1079US6503333B2Method for cleaning semiconductor wafers with ozone-containing solventTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jan 7, 2003·24 cites·9 claims
- 1178US6228760B1Use of PE-SiON or PE-OXIDE for contact or via photo and for defect reduction with oxide and W chemical-mechanical polishTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted May 8, 2001·46 cites·7 claims
- 1275US6722949B2Ventilated platen/polishing pad assembly for chemcial mechanical polishing and method of usingTAIWAN SEMICONDUCTORS MFG CO L·Filed 2001·Granted Apr 20, 2004·20 cites·18 claims
- 1375US6080656AMethod for forming a self-aligned copper structure with improved planarityTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 27, 2000·46 cites·14 claims
- 1474US6227947B1Apparatus and method for chemical mechanical polishing metal on a semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted May 8, 2001·35 cites·20 claims
- 1571US6376377B1Post chemical mechanical polish (CMP) planarizing substrate cleaning method employing enhanced substrate hydrophilicityTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Apr 23, 2002·14 cites·19 claims
- 1670US2024021453A1Method of monitoring toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1769US6878578B1Method for forming a high quality chemical oxide on a freshly cleaned silicon surface as a native oxide replacementTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 12, 2005·15 cites·22 claims
- 1868US6405452B1Method and apparatus for drying wafers after wet benchTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 18, 2002·14 cites·15 claims
- 1967US6620725B1Reduction of Cu line damage by two-step CMPTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Sep 16, 2003·32 cites·10 claims
- 2063US6837774B2Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of usingTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jan 4, 2005·9 cites·9 claims
- 2162US6153526AMethod to remove residue in wolfram CMPTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Nov 28, 2000·25 cites·37 claims
- 2260US12394684B2Die stacking structure, semiconductor package and formation method of the die stacking structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 2360US2025277936A1Waveguides and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2460US2025258338A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2558US10930527B2Method for controlling temperature of furnace in semiconductor fabrication processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 23, 2021·0 cites·20 claims
- 2657US6924215B2Method of monitoring high tilt angle of medium current implantTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 2, 2005·8 cites·6 claims
- 2756US6425191B1Apparatus and method for reducing solvent residue in a solvent-type dryer for semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 30, 2002·6 cites·18 claims
- 2856US2025096035A1Film-on-insulator substrate including a pre-notched film and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2955US6358119B1Way to remove CU line damage after CU CMPTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Mar 19, 2002·15 cites·9 claims
- 3055US2025372398A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3155US2025366372A1Wafer formation and processing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3254US6589356B1Method for cleaning a silicon-based substrate without NH4OH vapor damageTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 8, 2003·5 cites·11 claims
- 3354US6500753B2Method to reduce the damages of copper linesTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Dec 31, 2002·5 cites·30 claims
- 3453US2024363586A1Semiconductor package and forming method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3553US2025052966A1Photonic package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3652US2023360993A1Die stacking structure, semiconductor package and manufacturing method of the die stacking structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3752US2024371818A1Edge fill for stacked structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3851US10741426B2Method for controlling temperature of furnace in semiconductor fabrication processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 11, 2020·0 cites·20 claims
- 3950US6642128B1Method for high temperature oxidations to prevent oxide edge peelingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 4, 2003·4 cites·19 claims
- 4048US6211098B1Wet oxidation method for forming silicon oxide dielectric layerTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Apr 3, 2001·10 cites·7 claims
- 4148US2025053064A1Optical devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4247US11569062B2Gas delivery system for ion implanterTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
- 4347US6777251B2Metrology for monitoring a rapid thermal annealing processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 17, 2004·2 cites·17 claims
- 4445US6417106B1Underlayer liner for copper damascene in low k dielectricTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jul 9, 2002·11 cites·19 claims
- 4543US6706577B1Formation of dual gate oxide by two-step wet oxidationTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Mar 16, 2004·8 cites·19 claims
- 4643US6589872B1Use of low-high slurry flow to eliminate copper line damagesTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jul 8, 2003·8 cites·17 claims
- 4741US2003207582A1Use of low-high slurry flow to eliminate copper line damagesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
- 4838US11056365B2Fault detection method in semiconductor fabrication facilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 6, 2021·0 cites·20 claims
- 4936US2004043617A1Partitioned wafer boat for constant wafer backside emmissivityTAIWAN SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
- 5035US2003230323A1Apparatus and method for improving scrubber cleaningTAIWAN SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →