Inventor · disambiguated record
Ji Ho Uh
Also filed as: UH JI HO
4 granted patents·4 pending applications·8 citations·filing 2011–2024
65Inventor score
Top patents by PatentIndex Score
8 records- 0181US11098406B2Substrate support unit and deposition apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 24, 2021·5 cites·18 claims
- 0268US11021796B2Gas injectors and wafer processing apparatuses having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 1, 2021·1 cites·18 claims
- 0365US9263414B2Flip chip packaging method, and flux head manufacturing method applied to the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 16, 2016·2 cites·18 claims
- 0457US2025098036A1Method for manufacturing electrostatic chuckBOBOO HI TECH CO LTD·Filed 2024·Application pending·0 cites
- 0549US2024278437A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0646US2013255766A1Conductive paste compositions and solar cells using the sameSHIN JUNG-HWAN·Filed 2013·Application pending·0 cites
- 0739US8482870B2Lens module and wafer level lens module manufacturing apparatusUH JI HO·Filed 2011·Granted Jul 9, 2013·0 cites·12 claims
- 0838US2016115583A1Device and method for vacuum evaporatingSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →