Inventor · disambiguated record
Jia-You Wang
Also filed as: WANG JIA · Wang jia-you
4 granted patents·2 pending applications·3 citations·filing 2013–2024
60Inventor score
Files withIND TECH RES INST2YANGTZE MEMORY TECH CO LTD2HUIZHOU TCL MOBILE COMM CO LTD1HUIZHOU TCL MOBILE COMMUNICATION CO LTD1
Top patents by PatentIndex Score
6 records- 0174US10679854B2Wafer bonding method and structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jun 9, 2020·2 cites·19 claims
- 0264US2025350084A1Device and method for multi-wavelength laser driving and system and method for multi-wavelength laser processingIND TECH RES INST·Filed 2024·Application pending·0 cites
- 0360US11342185B2Wafer bonding method and structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted May 24, 2022·0 cites·16 claims
- 0458US9258024B2SIM card connector and mobile terminalHUIZHOU TCL MOBILE COMM CO LTD·Filed 2013·Granted Feb 9, 2016·1 cites·9 claims
- 0545US10872327B2Mobile payment systems and mobile payment methods thereofHUIZHOU TCL MOBILE COMMUNICATION CO LTD·Filed 2015·Granted Dec 22, 2020·0 cites·12 claims
- 0637US2020194962A1Laser deviceIND TECH RES INST·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →