Inventor · disambiguated record
Jia Wen Wang
Also filed as: Wang jia wen
9 granted patents·35 citations·filing 2018–2020
85Inventor score
Files withYANGTZE MEMORY TECH CO LTD9
Top patents by PatentIndex Score
9 records- 0194US10580788B2Methods for forming three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Mar 3, 2020·14 cites·20 claims
- 0290US10748851B1Hybrid bonding using dummy bonding contacts and dummy interconnectsYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Aug 18, 2020·6 cites·20 claims
- 0389US11462503B2Hybrid bonding using dummy bonding contactsYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Oct 4, 2022·2 cites·10 claims
- 0489US11289422B2Bonding alignment marks at bonding in interfaceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Mar 29, 2022·6 cites·14 claims
- 0588US11205619B2Hybrid bonding using dummy bonding contacts and dummy interconnectsYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Dec 21, 2021·2 cites·9 claims
- 0682US11049834B2Hybrid bonding using dummy bonding contactsYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jun 29, 2021·3 cites·20 claims
- 0774US10679854B2Wafer bonding method and structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jun 9, 2020·2 cites·19 claims
- 0866US11876049B2Bonding alignment marks at bonding interfaceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 16, 2024·0 cites·16 claims
- 0960US11342185B2Wafer bonding method and structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted May 24, 2022·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →