Inventor · disambiguated record
Jianghua Wei
Also filed as: WEI JIANGHUA
15 granted patents·649 citations·filing 1994–1997
95Inventor score
Top patents by PatentIndex Score
15 records- 0193US5804801AAdhesive bonding using variable frequency microwave energyLAMBDA TECHNOLOGIES INC·Filed 1997·Granted Sep 8, 1998·96 cites·13 claims
- 0292US5798395AAdhesive bonding using variable frequency microwave energyLAMBDA TECHNOLOGIES INC·Filed 1996·Granted Aug 25, 1998·82 cites·13 claims
- 0387US5648038ASystems and methods for monitoring material properties using microwave energyLAMBDA TECHNOLOGIES·Filed 1995·Granted Jul 15, 1997·90 cites·25 claims
- 0482US5879756ACuring polymer layers on semiconductor substrates using variable frequency microwave energyLAMBDA TECHNOLOGIES INC·Filed 1997·Granted Mar 9, 1999·63 cites·20 claims
- 0582US5738915ACuring polymer layers on semiconductor substrates using variable frequency microwave energyLAMBDA TECHNOLOGIES INC·Filed 1996·Granted Apr 14, 1998·66 cites·7 claims
- 0678US6312548B1Conductive insert for bonding components with microwave energyLAMBDA TECHNOLOGIES·Filed 1996·Granted Nov 6, 2001·42 cites·12 claims
- 0775US6497786B1Methods and apparatus for bonding deformable materials having low deformation temperaturesNIKE INC·Filed 1997·Granted Dec 24, 2002·72 cites·15 claims
- 0874US5844217AAppratus for liquid thermosetting resin molding using radiofrequency wave heatingUNIV MICHIGAN STATE·Filed 1997·Granted Dec 1, 1998·30 cites·8 claims
- 0969US6103812AMicrowave curable adhesiveLAMBDA TECHNOLOGIES INC·Filed 1997·Granted Aug 15, 2000·33 cites·23 claims
- 1065US5770143AMethod for liquid thermosetting resin molding using radiofrequency wave heatingUNIV MICHIGAN STATE·Filed 1996·Granted Jun 23, 1998·22 cites·11 claims
- 1164US5644837AProcess for assembling electronics using microwave irradiationLAMBDA TECHNOLOGIES INC·Filed 1995·Granted Jul 8, 1997·26 cites·28 claims
- 1239US5844216ASystem and apparatus for reducing arcing and localized heating during microwave processingLAMBDA TECHNOLOGIES INC·Filed 1997·Granted Dec 1, 1998·7 cites·22 claims
- 1337US5470423AMicrowave pultrusion apparatus and method of useUNIV MICHIGAN STATE·Filed 1994·Granted Nov 28, 1995·10 cites·15 claims
- 1435US5750968ASystem and apparatus for reducing arcing and localized heating during microwave processingLAMBDA TECHNOLOGIES INC·Filed 1995·Granted May 12, 1998·5 cites·14 claims
- 1527US5406056AElectromagnetic curing apparatus and method of useUNIV MICHIGAN STATE·Filed 1994·Granted Apr 11, 1995·5 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Jianghua Wei files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →