Inventor · disambiguated record
Jiean Wei
Also filed as: Wei Jiean
2 granted patents·0 citations·filing 2020–2022
22Inventor score
Files withUNIV JIANGSU2
Top patents by PatentIndex Score
2 records- 0163US12005633B2Method for photo-curing four-dimensional (4D) printing of multi-layer structure with adjustable shape recovery speed, and multi-layer structure prepared by photo-curing 4D printingUNIV JIANGSU·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 0252US11608817B2Electro-responsive folding and unfolding composite material for 4D printing, method for manufacturing same, and method for regulating shape memory behavior thereofUNIV JIANGSU·Filed 2020·Granted Mar 21, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →