Inventor · disambiguated record
Jieun Woo
Also filed as: WOO JIEUN
0 granted patents·2 pending applications·0 citations·filing 2016–2023
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0156US2024321804A1Semiconductor package including redistribution structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0228US2017053263A1Apparatus and method for providing information of electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jieun Woo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →