Inventor · disambiguated record
Jin-Chang Wu
Also filed as: WU JIN · WU JIN-CHANG
4 granted patents·6 pending applications·6 citations·filing 2009–2021
63Inventor score
Files withQUANTA COMP INC5RECKITT & COLMAN OVERSEAS HYGIENE HOME LTD3TECH FRONT SHANGHAI COMPUTER CO LTD1WANG XUN1
Top patents by PatentIndex Score
10 records- 0164USD1023265SElectrically powered air treatment deviceRECKITT & COLMAN OVERSEAS HYGIENE HOME LTD·Filed 2021·Granted Apr 16, 2024·4 cites·1 claims
- 0261US12259123B2CandleRECKITT & COLMAN OVERSEAS HYGIENE HOME LTD·Filed 2020·Granted Mar 25, 2025·0 cites·15 claims
- 0351USD1031964SAir treatment deviceRECKITT & COLMAN OVERSEAS HYGIENE HOME LTD·Filed 2021·Granted Jun 18, 2024·2 cites·1 claims
- 0448US2011024173A1Ball grid array printed circuit board, package structure, and fabricating method thereofQUANTA COMP INC·Filed 2009·Application pending·0 cites
- 0547US2014200289A1Organic montmorillonite enhanced epoxy resin and preparation method thereofQUANTA COMP INC·Filed 2013·Application pending·0 cites
- 0643US8895866B2Printed circuit board structureQUANTA COMP INC·Filed 2013·Granted Nov 25, 2014·0 cites·10 claims
- 0743US2014284080A1Printed circuit board and method of mounting integrated circuit packaging component on the sameTECH FRONT SHANGHAI COMPUTER CO LTD·Filed 2013·Application pending·0 cites
- 0839US2012316264A1Method of manufacturing organic montmorilloniteWANG XUN·Filed 2011·Application pending·0 cites
- 0932US2011235297A1Integrated circuit package component with lateral conductive pinsQUANTA COMP INC·Filed 2010·Application pending·0 cites
- 1032US2011235296A1Integrated circuit package component with ball conducting jointsQUANTA COMP INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →