Inventor · disambiguated record
Jiali Wu
Also filed as: WU JIALI
11 granted patents·6 pending applications·45 citations·filing 1999–2024
86Inventor score
Files withIBM7WU JIALI6GEORGIA TECH RES INST21 ZHEJIANG NOVUS PHARMACEUTICALS CO LTD1COFFIN JEFFREY T1
Top patents by PatentIndex Score
17 records- 0178US8492199B2Reworkable underfills for ceramic MCM C4 protectionCOFFIN JEFFREY T·Filed 2011·Granted Jul 23, 2013·6 cites·20 claims
- 0273US7808099B2Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related methodIBM·Filed 2008·Granted Oct 5, 2010·3 cites·3 claims
- 0368US6380322B1Reworkable high temperature adhesivesGEORGIA TECH RES INST·Filed 1999·Granted Apr 30, 2002·24 cites·46 claims
- 0464US6989433B2Low stress conformal coatings of reliability without hermeticity for microelectromechanical system based multichip module encapsulationGEORGIA TECH RES INST·Filed 2002·Granted Jan 24, 2006·6 cites·10 claims
- 0560US7932342B2Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend systemIBM·Filed 2008·Granted Apr 26, 2011·0 cites·1 claims
- 0649US7537487B2Crosstalk reduction in dual inline memory module (DIMM) connectorsIBM·Filed 2008·Granted May 26, 2009·3 cites·1 claims
- 0749US7407415B2Crosstalk reduction in dual inline memory module (DIMM) connectorsIBM·Filed 2006·Granted Aug 5, 2008·3 cites·1 claims
- 0848US2008076690A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2007·Application pending·0 cites
- 0947US2007290378A1Novel reworkable underfills for ceramic mcm c4 protectionIBM·Filed 2006·Application pending·0 cites
- 1040US2025000935A1High-Stability Daptomycin Composition For Injection, And Preparation Method Therefor And Use Thereof1 ZHEJIANG NOVUS PHARMACEUTICALS CO LTD·Filed 2021·Application pending·0 cites
- 1139US2005066995A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2003·Application pending·0 cites
- 1238US9157019B2Thermal conductivity improved composition with addition of nano particles used for interface materialsWU JIALI·Filed 2013·Granted Oct 13, 2015·0 cites·3 claims
- 1337USD1067490SSolar landscape lightWU JIALI·Filed 2024·Granted Mar 18, 2025·0 cites·1 claims
- 1434US9490142B2Cu-low K cleaning and protection compositionsWU JIALI·Filed 2015·Granted Nov 8, 2016·0 cites·2 claims
- 1533US2016096987A1Microscale Interface Materials for Enhancement of Electronics PerformanceWU JIALI·Filed 2014·Application pending·0 cites
- 1629US2019048292A1Processing Composition of Improved Metal Interconnect Protection and The Use ThereofWU JIALI·Filed 2017·Application pending·0 cites
- 1727US10190031B2Thermally conductive interface composition and use thereofWU JIALI·Filed 2016·Granted Jan 29, 2019·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →