Inventor · disambiguated record
Jiajia Yan
Also filed as: YAN JIAJIA
4 granted patents·10 pending applications·25 citations·filing 2011–2024
66Inventor score
Files withSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD9HANGZHOU CITY UNIV1HEFEI SILERGY SEMICONDUCTOR TECH CO LTD1NANJING SILERGY MICRO TECH CO LTD1UNIV ZHEJIANG1
Top patents by PatentIndex Score
14 records- 0183US2024404745A1Laminated transformer and manufacturing method thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2024·Application pending·0 cites
- 0282US8901774B2Distributed power supply system with digital power manager providing digital closed-loop power controlYAN JIAJIA·Filed 2011·Granted Dec 2, 2014·24 cites·20 claims
- 0381US2024161959A1Module structure and its manufacturing methodSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2023·Application pending·0 cites
- 0480US12080464B2Laminated transformer and manufacturing method thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2019·Granted Sep 3, 2024·1 cites·10 claims
- 0580US2024161958A1Inductor, manufacturing method for inductor, encapsulation module, and manufacturing method for encapsulation moduleSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2023·Application pending·0 cites
- 0667US2025095906A1Transformer structure, manufacturing method and integrated circuitSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2024·Application pending·0 cites
- 0764US2024170194A1Magnetic element, manufacturing method and power supply circuit thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2023·Application pending·0 cites
- 0862US2025157903A1Packaging module and manufacturing method thereforSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2024·Application pending·0 cites
- 0953US11302595B2Package assembly and method for manufacturing the same, package assembly of buck converterSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2020·Granted Apr 12, 2022·0 cites·19 claims
- 1051US2021193368A1Power transformer and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2020·Application pending·0 cites
- 1148US2022254561A1Transformer and package moduleHEFEI SILERGY SEMICONDUCTOR TECH CO LTD·Filed 2022·Application pending·0 cites
- 1247US11887942B2Package structure for power supply moduleNANJING SILERGY MICRO TECH CO LTD·Filed 2020·Granted Jan 30, 2024·0 cites·19 claims
- 1346US2025356068A1Jacking force prediction method for whole construction process by vertical jacking methodHANGZHOU CITY UNIV·Filed 2022·Application pending·0 cites
- 1445US2025148142A1Method for calculating opening response of shield tunnel with supportsUNIV ZHEJIANG·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →