Inventor · disambiguated record
Jin Yang
Also filed as: YANG JIN · YANG JIN-LIN
1 granted patent·5 pending applications·1 citations·filing 2002–2023
17Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0156US2023335526A1High-density-interconnection packaging structure and method for preparing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 0256US2023386967A1Wafer packaging system and method for manufacturing the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 0356US2023335478A12.5d/3d electronic packaging structure and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 0456US2023343669A1Electronic packaging structureSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 0556US2023386952A1Fan-out wafer-level packaging structure and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 0621USD485533SHybrid connector assemblyADVANCED CONNECTEK INC·Filed 2002·Granted Jan 20, 2004·1 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when Jin Yang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →