Inventor · disambiguated record
Jin Yang
Also filed as: YANG JIN · YANG JIN-SE
17 granted patents·9 pending applications·157 citations·filing 1995–2024
92Inventor score
Top patents by PatentIndex Score
26 records- 0190US8926196B2Method and apparatus for an optical interconnect systemINTEL CORP·Filed 2012·Granted Jan 6, 2015·13 cites·17 claims
- 0286US8891235B2Thermal interface for multi-chip packagesWALCZYK JOSEPH F·Filed 2012·Granted Nov 18, 2014·13 cites·30 claims
- 0382US9366482B2Adjustable heat pipe thermal unitINTEL CORP·Filed 2012·Granted Jun 14, 2016·5 cites·20 claims
- 0481US12490410B2Circuit devices integrated with boiling enhancement for two-phase immersion coolingINTEL CORP·Filed 2021·Granted Dec 2, 2025·1 cites·20 claims
- 0581US12133357B2Cold plate architecture for liquid cooling of devicesINTEL CORP·Filed 2020·Granted Oct 29, 2024·1 cites·20 claims
- 0679US2025071938A1Cold plate architecture for liquid cooling of devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0778US5669687AOptical projection systemDAEWOO ELECTRONICS CO LTD·Filed 1996·Granted Sep 23, 1997·53 cites·10 claims
- 0877US12293956B2Boiling enhancement structures for immersion cooled electronic systemsINTEL CORP·Filed 2021·Granted May 6, 2025·1 cites·24 claims
- 0965US12262478B2Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systemsINTEL CORP·Filed 2021·Granted Mar 25, 2025·0 cites·18 claims
- 1062US5612814ACompact sized optical projection systemDAEWOO ELECTRONICS CO LTD·Filed 1995·Granted Mar 18, 1997·28 cites·11 claims
- 1162US5541679AOptical projection systemDAEWOO ELECTRONICS CO LTD·Filed 1995·Granted Jul 30, 1996·25 cites·9 claims
- 1258US12442712B2Liquid cooling system leak detection improvementsINTEL CORP·Filed 2020·Granted Oct 14, 2025·0 cites·15 claims
- 1354US12309966B2Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading forceINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·17 claims
- 1453US12248344B2Technologies for liquid cooling interfacesINTEL CORP·Filed 2021·Granted Mar 11, 2025·0 cites·25 claims
- 1551US5560697AOptical projection systemDAEWOO ELECTRONICS CO LTD·Filed 1995·Granted Oct 1, 1996·17 cites·11 claims
- 1651US2023170327A1Integrated packaging architecture with solder and non-solder interconnectsINTEL CORP·Filed 2021·Application pending·0 cites
- 1749US12094800B2Thermally conductive slugs/active dies to improve cooling of stacked bottom diesINTEL CORP·Filed 2019·Granted Sep 17, 2024·0 cites·18 claims
- 1849US2021410320A1Immersion cooling system with coolant boiling point reduction for increased cooling capacityINTEL CORP·Filed 2021·Application pending·0 cites
- 1948US2021410328A1Cold plate with protective material to prevent reaction with liquid coolantINTEL CORP·Filed 2021·Application pending·0 cites
- 2048US2023137684A1Boiling enhancement for two-phase immersion cooling of integrated circuit devicesINTEL CORP·Filed 2021·Application pending·0 cites
- 2148US2024260228A1Immersion cooling systems, apparatus, and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 2247US2021219459A1Two-phase manifold cold plate for liquid coolingINTEL CORP·Filed 2021·Application pending·0 cites
- 2346US2016263714A1Adjustable heat pipe thermal unitINTEL CORP·Filed 2016·Application pending·0 cites
- 2443US10578647B2Probes for wafer sortingINTEL CORP·Filed 2017·Granted Mar 3, 2020·0 cites·14 claims
- 2543US10101367B2Microelectronic test device including a probe card having an interposerINTEL CORP·Filed 2015·Granted Oct 16, 2018·0 cites·24 claims
- 2642US2021345519A1Technologies for reconfigurable heat sinksINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →