Inventor · disambiguated record
Jimin Yao
Also filed as: YAO JIMIN
22 granted patents·9 pending applications·185 citations·filing 2007–2025
93Inventor score
Top patents by PatentIndex Score
31 records- 0195US7705280B2Multispectral plasmonic crystal sensorsUNIV ILLINOIS·Filed 2007·Granted Apr 27, 2010·137 cites·43 claims
- 0293US12224261B2Mixed hybrid bonding structures and methods of forming the sameINTEL CORP·Filed 2021·Granted Feb 11, 2025·2 cites·15 claims
- 0392US11735552B2Microelectronic package with solder array thermal interface material (SA-TIM)INTEL CORP·Filed 2019·Granted Aug 22, 2023·6 cites·20 claims
- 0492US11049791B1Heat spreading layer integrated within a composite IC die structure and methods of forming the sameINTEL CORP·Filed 2019·Granted Jun 29, 2021·7 cites·22 claims
- 0591US9842818B2Variable ball height on ball grid array packages by solder paste transferINTEL CORP·Filed 2016·Granted Dec 12, 2017·7 cites·16 claims
- 0690US11183477B2Mixed hybrid bonding structures and methods of forming the sameINTEL CORP·Filed 2019·Granted Nov 23, 2021·6 cites·15 claims
- 0788US11387175B2Interposer package-on-package (PoP) with solder array thermal contactsINTEL CORP·Filed 2018·Granted Jul 12, 2022·6 cites·16 claims
- 0888US11355849B2Antenna package using ball attach array to connect antenna and base substratesINTEL CORP·Filed 2017·Granted Jun 7, 2022·4 cites·21 claims
- 0981US2025226583A1Antenna package using ball attach array to connect antenna and base substratesINTEL CORP·Filed 2025·Application pending·0 cites
- 1080US10297567B2Thermocompression bonding using plasma gasINTEL CORP·Filed 2015·Granted May 21, 2019·5 cites·23 claims
- 1180US2025096178A1Microelectronic package with solder array thermal interface material (sa-tim)INTEL CORP·Filed 2024·Application pending·0 cites
- 1279US12205915B2Microelectronic package with solder array thermal interface material (SA-TIM)INTEL CORP·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 1376US11870163B2Antenna package using ball attach array to connect antenna and base substratesINTEL CORP·Filed 2022·Granted Jan 9, 2024·0 cites·25 claims
- 1476US10249515B2Electronic device packageINTEL CORP·Filed 2016·Granted Apr 2, 2019·2 cites·9 claims
- 1573US10504863B2Variable ball height on ball grid array packages by solder paste transferINTEL CORP·Filed 2018·Granted Dec 10, 2019·1 cites·14 claims
- 1669US11322455B2Robust mold integrated substrateINTEL CORP·Filed 2017·Granted May 3, 2022·1 cites·20 claims
- 1768US12327801B2Robust mold integrated substrateINTEL CORP·Filed 2022·Granted Jun 10, 2025·0 cites·20 claims
- 1867US11929295B2Multi-use package architectureINTEL CORP·Filed 2022·Granted Mar 12, 2024·0 cites·14 claims
- 1967US11581238B2Heat spreading layer integrated within a composite IC die structure and methods of forming the sameINTEL CORP·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
- 2064US9721880B2Integrated circuit package structuresINTEL CORP·Filed 2015·Granted Aug 1, 2017·1 cites·22 claims
- 2157US10256205B2Variable ball height on ball grid array packages by solder paste transferINTEL CORP·Filed 2017·Granted Apr 9, 2019·0 cites·5 claims
- 2253US2025391664A1Plasma Dicing for Multi-Tier Die for Die Strength Enhancement and Irregular Shaped DicingAPPLE INC·Filed 2025·Application pending·0 cites
- 2353US2019228988A1Electronic device packageINTEL CORP·Filed 2019·Application pending·0 cites
- 2449US2019287872A1Multi-use package architectureINTEL CORP·Filed 2018·Application pending·0 cites
- 2546US11735551B2Aligned core balls for interconnect joint stabilityINTEL CORP·Filed 2019·Granted Aug 22, 2023·0 cites·20 claims
- 2645US12003023B2In-package 3D antennaINTEL CORP·Filed 2019·Granted Jun 4, 2024·0 cites·10 claims
- 2745US10672625B2Electronic device package with recessed substrate for underfill containmentINTEL CORP·Filed 2016·Granted Jun 2, 2020·0 cites·16 claims
- 2845US2023084375A1Selective protection of integrated circuit chip surface regions from underfill contactINTEL CORP·Filed 2021·Application pending·0 cites
- 2941US2020388576A1Layer for etched identification marks on a packageINTEL CORP·Filed 2019·Application pending·0 cites
- 3032US2017166407A1Universal pick and place head for handling components of any shapeINTEL CORP·Filed 2015·Application pending·0 cites
- 3130US2017290211A1Batch component placement templateINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →