Inventor · disambiguated record

Jinxin Yi

Also filed as: YI JINXIN

2 granted patents·0 citations·filing 2021–2022

22Inventor score

Technology areasH10P H10W

Files withNexperia BV1 ZHUHAI ACCESS SEMICONDUCTOR CO LTD1

Top patents by PatentIndex Score

2 records

0150US12463055B2Package substrate manufacturing methodZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·10 claims
0247US12476220B2Substrate-based package semiconductor device with side wettable flanksNexperia BV·Filed 2022·Granted Nov 18, 2025·0 cites·18 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →