Inventor · disambiguated record
Jin Yi
Also filed as: YI JIN · Yi jin xin
1 granted patent·1 pending application·0 citations·filing 2019–2023
4Inventor score
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2 records- 0147US2023223325A1Semiconductor package substrate made from non-metallic material and a method of manufacturing thereofNexperia BV·Filed 2023·Application pending·0 cites
- 0238US10964797B2Semiconductor structure and method for forming sameSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2019·Granted Mar 30, 2021·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →