Inventor · disambiguated record
Jin O Yoo
Also filed as: YOO JIN O · YOO JIN OOK · YOO JIN YOEL
8 granted patents·12 pending applications·13 citations·filing 2002–2024
79Inventor score
Top patents by PatentIndex Score
20 records- 0179US9793223B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 17, 2017·3 cites·7 claims
- 0274US9508624B2Semiconductor package and method of manufacturing the sameYOO JIN O·Filed 2012·Granted Nov 29, 2016·4 cites·4 claims
- 0370US8558377B2Semiconductor package moduleYOO JIN O·Filed 2011·Granted Oct 15, 2013·4 cites·7 claims
- 0466US12087510B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 0560US12368002B2Multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 0658US8004580B2Apparatus and method for managing images of mobile terminalLG ELECTRONICS INC·Filed 2006·Granted Aug 23, 2011·2 cites·7 claims
- 0755US2025249746A1Vehicle information provision system, information provision method thereof, and vehicle including sameHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0854US2024055186A1Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0953US9392697B2Package and method of manufacturing package thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Jul 12, 2016·0 cites·7 claims
- 1049US2015004753A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1149US2015173197A1Printed circuit board having inductor embedded therein and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1244US2016255726A1Package and method of manufacturing package thereofSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 1343US2020304167A1Front end moduleSAMSUNG ELECTRO MECH·Filed 2019·Application pending·0 cites
- 1441US2012104571A1Semiconductor package and manufacturing method thereofYOO JIN O·Filed 2011·Application pending·0 cites
- 1540US2003081593A1Method for charging internet phone networkLG ELECTRONICS INC·Filed 2002·Application pending·0 cites
- 1638US9520122B2Audio apparatus and controlling method thereofHYUNDAI MOTOR CO LTD·Filed 2014·Granted Dec 13, 2016·0 cites·13 claims
- 1735US2013037923A1Semiconductor package and method of manufacturing the sameYOO JIN O·Filed 2012·Application pending·0 cites
- 1835US2003171035A1Connecting structure for USBSAMSUNG ELECTRO MECH·Filed 2002·Application pending·0 cites
- 1934US2006091517A1Stacked semiconductor multi-chip packageSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 2033US2016029479A1Electrostatic discharge protection boardSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →