Inventor · disambiguated record
Jin H. Yoon
Also filed as: YOON JIN H · YOON JIN HYUN
6 granted patents·1 pending application·176 citations·filing 1991–2025
85Inventor score
Top patents by PatentIndex Score
7 records- 0184US6041495AMethod of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Mar 28, 2000·82 cites·3 claims
- 0268US6245490B1Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jun 12, 2001·15 cites·10 claims
- 0367US5478973ASemiconductor chip contact bump structureSAMSUNG ELECTRONICS CO INC·Filed 1994·Granted Dec 26, 1995·40 cites·7 claims
- 0461US6037662AChip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Mar 14, 2000·28 cites·29 claims
- 0558US2025332727A1System and method for predicting failure of articulated robotYUILROBOTICS CO LTD·Filed 2025·Application pending·0 cites
- 0641US5291127AChip-lifetime testing instrument for semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 1991·Granted Mar 1, 1994·11 cites·7 claims
- 0727US5281759ASemiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 1991·Granted Jan 25, 1994·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →