Inventor · disambiguated record
Jin Yu
Also filed as: YU JIN · YU JIN YOUNG
6 granted patents·8 pending applications·78 citations·filing 1998–2024
82Inventor score
Files withKOREA ADVANCED INST SCI & TECH5YU JIN4CHANG KUANG-YEH1LX SEMICON CO LTD1SAMSUNG DISPLAY CO LTD1
Top patents by PatentIndex Score
14 records- 0190US6902660B2Method of manufacturing printed circuit board and multi-layered PCBKOREA ADVANCED INST SCI & TECH·Filed 2002·Granted Jun 7, 2005·36 cites·10 claims
- 0281US8951306B2Film-type supercapacitor and manufacturing method thereofYU JIN·Filed 2012·Granted Feb 10, 2015·5 cites·12 claims
- 0379US12499808B2Source drive integrated circuit and display device including the sameLX SEMICON CO LTD·Filed 2024·Granted Dec 16, 2025·0 cites·15 claims
- 0473US7387910B2Method of bonding solder pads of flip-chip packageKOREA ADVANCED INST SCI & TECH·Filed 2006·Granted Jun 17, 2008·6 cites·9 claims
- 0571US6716738B2Method of fabricating multilayered UBM for flip chip interconnections by electroplatingKOREA ADVANCED INST SCI & TECH·Filed 2002·Granted Apr 6, 2004·19 cites·14 claims
- 0668US2025286204A1Cylindrical secondary batterySAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0763US2011011820A1Wine bottle cap assembly and manufacturing method and apparatus thereofUNIV KOREA RES & BUS FOUND·Filed 2009·Application pending·0 cites
- 0857US2025107395A1Display deviceSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 0949US6110276AMethod for making n-type semiconductor diamondKOREA ADVANCED INST SCI & TECH·Filed 1998·Granted Aug 29, 2000·12 cites·14 claims
- 1046US2008237314A1Method of joining electronic package capable of prevention for brittle fractureYU JIN·Filed 2007·Application pending·0 cites
- 1142US2007199826A1Method for manufacturing metal/carbon nanotube nano-composite using electroplatingKOREA ADVANCED INST SCI & TECH·Filed 2006·Application pending·0 cites
- 1240US2007298620A1Surface treatment, sorting and assembling methods of microelectronic devices and storage structure thereofCHANG KUANG-YEH·Filed 2006·Application pending·0 cites
- 1340US2010240174A1Via Using Zn or Zn Alloys and Its Making Method, 3D Chip Stack Packages Using ThereofYU JIN·Filed 2007·Application pending·0 cites
- 1437US2008265006A1Method for bonding electronic components finished with electroless NiXP for preventing brittle fractureYU JIN·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →