Inventor · disambiguated record
John Acocella
Also filed as: ACOCELLA JOHN
15 granted patents·780 citations·filing 1983–1996
95Inventor score
Top patents by PatentIndex Score
15 records- 0195US5591941ASolder ball interconnected assemblyIBM·Filed 1993·Granted Jan 7, 1997·183 cites·28 claims
- 0293US4747907AMetal etching process with etch rate enhancementIBM·Filed 1986·Granted May 31, 1988·59 cites·15 claims
- 0387US5294830AApparatus for indirect impingement cooling of integrated circuit chipsIBM·Filed 1991·Granted Mar 15, 1994·99 cites·22 claims
- 0486US5675889ASolder ball connections and assembly processIBM·Filed 1995·Granted Oct 14, 1997·77 cites·20 claims
- 0577US6504105B1Solder ball connections and assembly processIBM·Filed 1996·Granted Jan 7, 2003·44 cites·2 claims
- 0677US4753694AProcess for forming multilayered ceramic substrate having solid metal conductorsIBM·Filed 1986·Granted Jun 28, 1988·49 cites·7 claims
- 0776US5108541AProcesses for electrically conductive decals filled with inorganic insulator materialIBM·Filed 1991·Granted Apr 28, 1992·67 cites·19 claims
- 0872US5338900AStructures for electrically conductive decals filled with inorganic insulator materialIBM·Filed 1992·Granted Aug 16, 1994·55 cites·20 claims
- 0971US4879156AMultilayered ceramic substrate having solid non-porous metal conductorsIBM·Filed 1988·Granted Nov 7, 1989·38 cites·12 claims
- 1060US5031029ACopper device and use thereof with semiconductor devicesIBM·Filed 1990·Granted Jul 9, 1991·28 cites·20 claims
- 1158US5135595AProcess for fabricating a low dielectric composite substrateIBM·Filed 1990·Granted Aug 4, 1992·24 cites·9 claims
- 1253US5139851ALow dielectric composite substrateIBM·Filed 1990·Granted Aug 18, 1992·22 cites·19 claims
- 1351US5277725AProcess for fabricating a low dielectric composite substrateIBM·Filed 1992·Granted Jan 11, 1994·17 cites·15 claims
- 1444US4620863ARadiation coloration resistant glassRENSSELAER POLYTECH INST·Filed 1983·Granted Nov 4, 1986·12 cites·1 claims
- 1534US5167913AMethod of forming an adherent layer of metallurgy on a ceramic substrateIBM·Filed 1991·Granted Dec 1, 1992·6 cites·25 claims
Join the waitlist — get patent alerts
Get an alert when John Acocella files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →