Inventor · disambiguated record
Joseph A. Aurichio
Also filed as: AURICHIO JOSEPH A
11 granted patents·638 citations·filing 1974–1989
93Inventor score
Top patents by PatentIndex Score
11 records- 0190US4961804ACarrier film with conductive adhesive for dicing of semiconductor wafers and dicing method employing sameINVESTMENT HOLDING CORP·Filed 1986·Granted Oct 9, 1990·122 cites·17 claims
- 0289US4761335AAlpha-particle protection of semiconductor devicesNAT STARCH CHEM CORP·Filed 1985·Granted Aug 2, 1988·103 cites·8 claims
- 0389US4664739ARemoval of semiconductor wafers from dicing filmSTAUFFER CHEMICAL CO·Filed 1983·Granted May 12, 1987·73 cites·13 claims
- 0486US4604230AThermally stable adhesiveSTAUFFER CHEMICAL CO·Filed 1984·Granted Aug 5, 1986·48 cites·97 claims
- 0585US5158818AConductive die attach tapeNAT STARCH CHEM INVEST·Filed 1989·Granted Oct 27, 1992·69 cites·33 claims
- 0685US4687693AAdhesively mountable die attach filmSTAUFFER CHEMICAL CO·Filed 1985·Granted Aug 18, 1987·77 cites·12 claims
- 0780US4692272AThermally stable adhesive comprising soluble polyimide resin and epoxy resinSTAUFFER CHEMICAL CO·Filed 1985·Granted Sep 8, 1987·44 cites·53 claims
- 0875US4793883AMethod of bonding a semiconductor chip to a substrateNAT STARCH CHEM CORP·Filed 1986·Granted Dec 27, 1988·49 cites·2 claims
- 0970US5030308AMethod of bonding a semiconductor chip to a substrateNAT STARCH CHEM INVEST·Filed 1988·Granted Jul 9, 1991·39 cites·11 claims
- 1060US4067841AVinyl chloride interpolymer coating compositionSTAUFFER CHEMICAL CO·Filed 1975·Granted Jan 10, 1978·8 cites·10 claims
- 1146US3997704AProcess and polyvinyl chloride interpolymer composition for coating a material and the product therefromSTAUFFER CHEMICAL CO·Filed 1974·Granted Dec 14, 1976·6 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →