Inventor · disambiguated record
Jong Hwan Baek
Also filed as: BAEK JONG H · BAEK JONG-HWAN
7 granted patents·15 pending applications·68 citations·filing 2003–2024
84Inventor score
Top patents by PatentIndex Score
22 records- 0192US7663250B2Wafer level package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 16, 2010·26 cites·12 claims
- 0284US7598528B2High power light emitting diode package and method of producing the sameSAMSUNG ELECTRO MECH·Filed 2007·Granted Oct 6, 2009·12 cites·7 claims
- 0382US7511312B2Surface mounting device-type light emitting diodeSAMSUNG ELECTRO MECH·Filed 2007·Granted Mar 31, 2009·12 cites·8 claims
- 0478US8143099B2Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layerPARK SEUNG WOOK·Filed 2009·Granted Mar 27, 2012·8 cites·12 claims
- 0573US7727877B2Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillarSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 1, 2010·6 cites·5 claims
- 0671US7846754B2High power light emitting diode package and method of producing the sameSAMSUNG LED CO LTD·Filed 2009·Granted Dec 7, 2010·4 cites·6 claims
- 0762US2025198219A1Door part used in semiconductor substrate processing deviceYEST CO LTD·Filed 2024·Application pending·0 cites
- 0856US2025191942A1Substrate processing apparatusYEST CO LTD·Filed 2024·Application pending·0 cites
- 0956US2025234428A1Substrate processing apparatusYEST CO LTD·Filed 2024·Application pending·0 cites
- 1050US2011244515A1Method of preparing protein having high content of specific amino acid by co-expression with trna of specific amino acidLEE SANG YUP·Filed 2009·Application pending·0 cites
- 1148US2014313676A1Electronic component packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1247US8779580B2Electronic component package and manufacturing method thereofKANG JOON-SEOK·Filed 2008·Granted Jul 15, 2014·0 cites·5 claims
- 1347US2010149770A1Semiconductor stack packageSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1446US2009253259A1Solder ball attachment jig and method for manufacturing semiconductor device using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1545US2009166859A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1645US2009302468A1Printed circuit board comprising semiconductor chip and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1745US2009166862A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1841US2007171673A1Side view LED package and backlight unit using the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1941US2008211083A1Electronic package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2039US2007075325A1High power light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2139US2006267040A1High-brightness LED with protective function of electrostatic discharge damageSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2232US2004061206A1Discrete package having insulated ceramic heat sinkFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →