Inventor · disambiguated record
Jonghwan Baek
Also filed as: BAEK JONGHWAN
4 granted patents·4 pending applications·1 citations·filing 2020–2025
60Inventor score
Technology areasH10W
Files withSEMICONDUCTOR COMPONENTS IND LLC8
Top patents by PatentIndex Score
8 records- 0180US11652030B2Power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 16, 2023·1 cites·18 claims
- 0276US2025125227A1Power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0375US12211771B2Power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jan 28, 2025·0 cites·13 claims
- 0475US2025273646A1Dual cool power module with stress buffer layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0574US12300689B2Dual cool power module with stress buffer layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 13, 2025·0 cites·18 claims
- 0665US11658171B2Dual cool power module with stress buffer layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 23, 2023·0 cites·16 claims
- 0756US2025279340A1Multi-chip semiconductor module with balanced switchingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0854US2025132231A1Slotted clips for reduction of molding compound delaminationSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →