Inventor · disambiguated record
Joseph C. Barrett
Also filed as: BARRETT JOSEPH C
10 granted patents·1 pending application·377 citations·filing 1996–2002
91Inventor score
Top patents by PatentIndex Score
11 records- 0194US6545351B1Underside heat slug for ball grid array packagesINTEL CORP·Filed 2000·Granted Apr 8, 2003·120 cites·44 claims
- 0288US6060777AUnderside heat slug for ball grid array packagesINTEL CORP·Filed 1998·Granted May 9, 2000·102 cites·10 claims
- 0384US5933324AApparatus for dissipating heat from a conductive layer in a circuit boardINTEL CORP·Filed 1997·Granted Aug 3, 1999·82 cites·17 claims
- 0462US6404067B1Plastic ball grid array package with improved moisture resistanceINTEL CORP·Filed 2000·Granted Jun 11, 2002·12 cites·13 claims
- 0555US6605492B2Plastic ball grid array assemblyINTEL CORP·Filed 2000·Granted Aug 12, 2003·5 cites·22 claims
- 0655US5810459AStackable modular cabinetUNISYS CORP·Filed 1996·Granted Sep 22, 1998·28 cites·42 claims
- 0753US6310298B1Printed circuit board substrate having solder mask-free edgesINTEL CORP·Filed 1997·Granted Oct 30, 2001·17 cites·8 claims
- 0850US6867506B2Plastic ball grid array assemblyINTEL CORP·Filed 2001·Granted Mar 15, 2005·3 cites·23 claims
- 0943US6064117APlastic ball grid array assemblyINTEL CORP·Filed 1997·Granted May 16, 2000·8 cites·10 claims
- 1037US6564452B2Method for creating printed circuit board substrates having solder mask-free edgesINTEL CORP·Filed 2001·Granted May 20, 2003·0 cites·15 claims
- 1134US2003183934A1Method and apparatus for stacking multiple die in a flip chip semiconductor packageFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →