Inventor · disambiguated record
John A. Bauer
Also filed as: BAUER JOHN · BAUER JOHN A · BAUER JR JOHN ALBERT
10 granted patents·7 pending applications·112 citations·filing 1984–2024
87Inventor score
Top patents by PatentIndex Score
17 records- 0188US7808776B2Apparatus and methods for supporting a display panel of a portable information handling systemDELL PRODUCTS LP·Filed 2008·Granted Oct 5, 2010·14 cites·26 claims
- 0287US7545629B1Methods and systems for assembly of a displayDELL PRODUCTS LP·Filed 2008·Granted Jun 9, 2009·25 cites·19 claims
- 0383US4600970ALeadless chip carriers having self-aligning mounting padsRCA CORP·Filed 1984·Granted Jul 15, 1986·47 cites·8 claims
- 0480US7806741B1Marine propulsion system with separate air intake and cooling systemsBRUNSWICK CORP·Filed 2009·Granted Oct 5, 2010·13 cites·15 claims
- 0573US8632711B2Method for manufacture of information handling system laminated housingsMUNDT KEVIN·Filed 2010·Granted Jan 21, 2014·2 cites·4 claims
- 0671US7887332B2System and method for rotatable information handling system power cable connectionDELL PRODUCTS LP·Filed 2009·Granted Feb 15, 2011·11 cites·5 claims
- 0766US12256515B2Cable management perch for use with rack rail-mounted chassisSANMINA CORP·Filed 2022·Granted Mar 18, 2025·0 cites·22 claims
- 0866US12137541B2Enhanced fan integration in data storage systemsSANMINA CORP·Filed 2022·Granted Nov 5, 2024·0 cites·13 claims
- 0960US11570894B2Through-hole and surface mount printed circuit card connections for improved power component solderingROCKWELL COLLINS INC·Filed 2021·Granted Jan 31, 2023·0 cites·9 claims
- 1057US2025227837A1Selective removal of adhesive from coverlay for printed circuit board insulationROCKWELL COLLINS INC·Filed 2024·Application pending·0 cites
- 1157US2025227854A1Coverlay as printed circuit board (pcb) voltage insulator under connectorsHAMILTON SUNDSTRAND CORP·Filed 2024·Application pending·0 cites
- 1254US2025151205A1Methods for promoting selective copper foil adhesion in a printed circuit boardROCKWELL COLLINS INC·Filed 2023·Application pending·0 cites
- 1354US2025212320A1Method for accommodating substrate warpage in printed circuit board assembliesROCKWELL COLLINS INC·Filed 2023·Application pending·0 cites
- 1450US2025261315A1Temporary panel railsROCKWELL COLLINS INC·Filed 2024·Application pending·0 cites
- 1543US8353996B2System and method for manufacture of information handling system laminated housingsDELL PRODUCTS LP·Filed 2010·Granted Jan 15, 2013·0 cites·15 claims
- 1637US2011128690A1System and method for rotatable information handling system power cable connectionBAUER JOHN·Filed 2011·Application pending·0 cites
- 1735US2011171846A1Circuit Card Latching Arm Arresting ApparatusDELL PRODUCTS LP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →