Inventor · disambiguated record
John Bultitude
Also filed as: BULTITUDE JOHN
62 granted patents·8 pending applications·416 citations·filing 1991–2023
98Inventor score
Top patents by PatentIndex Score
70 records- 0196US10707145B2High density multi-component packagesKEMET ELECTRONICS CORP·Filed 2017·Granted Jul 7, 2020·24 cites·44 claims
- 0295US9793057B2Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bondKEMET ELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·12 cites·20 claims
- 0395US9490072B2Method of making a high capacitance multilayer capacitor with high voltage capabilityKEMET ELECTRONICS CORP·Filed 2014·Granted Nov 8, 2016·18 cites·12 claims
- 0495US9087648B2Asymmetric high voltage capacitorKEMET ELECTRONICS CORP·Filed 2013·Granted Jul 21, 2015·19 cites·27 claims
- 0594US8885319B2High capacitance multilayer with high voltage capabilityBULTITUDE JOHN·Filed 2010·Granted Nov 11, 2014·22 cites·20 claims
- 0693US7336475B2High voltage capacitorsVISHAY VITRAMON INC·Filed 2006·Granted Feb 26, 2008·35 cites·16 claims
- 0792US11621126B2Resonant multilayer ceramic capacitorsKEMET ELECTRONICS CORP·Filed 2021·Granted Apr 4, 2023·2 cites·67 claims
- 0892US9779874B2Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materialsMCCONNELL JOHN E·Filed 2012·Granted Oct 3, 2017·9 cites·25 claims
- 0992US9748043B2Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitorsKEMET ELECTRONICS CORP·Filed 2013·Granted Aug 29, 2017·9 cites·46 claims
- 1092US9472342B2Leadless multi-layered ceramic capacitor stacksKEMET ELECTRONICS CORP·Filed 2013·Granted Oct 18, 2016·13 cites·28 claims
- 1192US9171672B2Stacked leaded arrayMCCONNELL JOHN E·Filed 2012·Granted Oct 27, 2015·19 cites·14 claims
- 1292US9025311B1Very large ceramic capacitor with mechanical shock resistanceKEMET ELECTRONICS CORP·Filed 2013·Granted May 5, 2015·10 cites·20 claims
- 1392US8896986B2Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitorsCHACKO ANTONY P·Filed 2011·Granted Nov 25, 2014·11 cites·22 claims
- 1492US8885324B2Overvoltage protection componentBULTITUDE JOHN·Filed 2012·Granted Nov 11, 2014·13 cites·33 claims
- 1591US10178770B1Higher density multi-component and serial packagesKEMET ELECTRONICS CORP·Filed 2017·Granted Jan 8, 2019·6 cites·43 claims
- 1691US9805872B2Multiple MLCC modulesKEMET ELECTRONICS CORP·Filed 2015·Granted Oct 31, 2017·5 cites·38 claims
- 1791US8902565B2Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastesMCCONNELL JOHN E·Filed 2011·Granted Dec 2, 2014·19 cites·18 claims
- 1891US7715173B2High voltage capacitorsVISHAY SPRAGUE INC·Filed 2008·Granted May 11, 2010·23 cites·20 claims
- 1989US10147544B1Multilayer ceramic capacitor structures for use at high powerKEMET ELECTRONICS CORP·Filed 2017·Granted Dec 4, 2018·3 cites·25 claims
- 2089US8264816B2Externally fused and resistively loaded safety capacitorBULTITUDE JOHN·Filed 2009·Granted Sep 11, 2012·15 cites·40 claims
- 2189US8028397B2Method of making a frame package array deviceVISHAY SPRAGUE INC·Filed 2008·Granted Oct 4, 2011·15 cites·6 claims
- 2288US8331078B2Leaded multi-layer ceramic capacitor with low ESL and low ESRMCCONNELL JOHN E·Filed 2010·Granted Dec 11, 2012·12 cites·30 claims
- 2387US10410794B2Multilayer ceramic structureKEMET ELECTRONICS CORP·Filed 2017·Granted Sep 10, 2019·2 cites·36 claims
- 2486US10381162B2Leadless stack comprising multiple componentsKEMET ELECTRONICS CORP·Filed 2017·Granted Aug 13, 2019·5 cites·32 claims
- 2585US10840023B2Multilayered ceramic capacitor structures for use at high powerKEMET ELECTRONICS CORP·Filed 2018·Granted Nov 17, 2020·2 cites·25 claims
- 2682US10681814B2High density multi-component packagesKEMET ELECTRONICS CORP·Filed 2017·Granted Jun 9, 2020·3 cites·60 claims
- 2782US10622157B2Multilayer ceramic structureKEMET ELECTRONICS CORP·Filed 2019·Granted Apr 14, 2020·1 cites·19 claims
- 2882US8904609B2Externally fused and resistively loaded safety capacitorBULTITUDE JOHN·Filed 2011·Granted Dec 9, 2014·6 cites·2 claims
- 2979US9142353B2Discharge capacitorKEMET ELECTRONICS CORP·Filed 2014·Granted Sep 22, 2015·3 cites·64 claims
- 3078US12040135B2Resonant multilayer ceramic capacitorsKEMET ELECTRONICS CORP·Filed 2023·Granted Jul 16, 2024·0 cites·87 claims
- 3177US10068707B2Leadless multi-layered ceramic capacitor stacksKEMET ELECTRONICS CORP·Filed 2015·Granted Sep 4, 2018·2 cites·32 claims
- 3276US9881744B2Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bondsKEMET ELECTRONICS CORP·Filed 2014·Granted Jan 30, 2018·3 cites·36 claims
- 3373US11432448B2Method of forming an electronic deviceKEMET ELECTRONICS CORP·Filed 2020·Granted Aug 30, 2022·0 cites·30 claims
- 3473US8947852B2Integrated EMI filter and surge protection componentKEMET ELECTRONICS CORP·Filed 2013·Granted Feb 3, 2015·2 cites·23 claims
- 3571US10984955B2Electronic component structures with reduced microphonic noiseKEMET ELECTRONICS CORP·Filed 2019·Granted Apr 20, 2021·1 cites·37 claims
- 3671US8125762B2High voltage capacitorsBULTITUDE JOHN·Filed 2008·Granted Feb 28, 2012·5 cites·49 claims
- 3769US10593483B2Multilayer ceramic structureKEMET ELECTRONICS CORP·Filed 2019·Granted Mar 17, 2020·0 cites·40 claims
- 3869US8238075B2High voltage capacitorsBULTITUDE JOHN·Filed 2008·Granted Aug 7, 2012·5 cites·40 claims
- 3967US11393636B2Ceramic overvoltage protection device having low capacitance and improved durabilityKEMET ELECTRONICS CORP·Filed 2020·Granted Jul 19, 2022·0 cites·22 claims
- 4067US10366836B2Electronic component structures with reduced microphonic noiseKEMET ELECTRONICS CORP·Filed 2016·Granted Jul 30, 2019·1 cites·30 claims
- 4163US11393635B2Ceramic overvoltage protection device having low capacitance and improved durabilityKEMET ELECTRONICS CORP·Filed 2018·Granted Jul 19, 2022·0 cites·58 claims
- 4263US10757811B2Higher density multi-component and serial packagesKEMET ELECTRONICS CORP·Filed 2018·Granted Aug 25, 2020·0 cites·30 claims
- 4362US11178800B2Ceramic overvoltage protection device having low capacitance and improved durabilityKEMET ELECTRONICS CORP·Filed 2019·Granted Nov 16, 2021·0 cites·29 claims
- 4460US9287844B2Surface mountable multi-layer ceramic filterBULTITUDE JOHN·Filed 2012·Granted Mar 15, 2016·1 cites·36 claims
- 4559US10729051B2Component stability structureKEMET ELECTRONICS CORP·Filed 2016·Granted Jul 28, 2020·0 cites·27 claims
- 4659US2014139971A1Sintering of High Temperature Conductive and Resistive Pastes onto Temperature Sensitive and Atmospheric Sensitive MaterialsKEMET ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 4757US10790094B2Method of forming a leadless stack comprising multiple componentsKEMET ELECTRONICS CORP·Filed 2019·Granted Sep 29, 2020·0 cites·10 claims
- 4856US11227719B2Leadless multi-layered ceramic capacitor stackKEMET ELECTRONICS CORP·Filed 2018·Granted Jan 18, 2022·0 cites·20 claims
- 4956US2020260618A1Ceramic Overvoltage Protection Device Having Low Capacitance and Improved DurabilityKEMET ELECTRONICS CORP·Filed 2020·Application pending·0 cites
- 5055US11923151B2Structural lead frameKEMET ELECTRONICS CORP·Filed 2021·Granted Mar 5, 2024·0 cites·45 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →