Inventor · disambiguated record
John T. Cain
Also filed as: CAIN JOHN T
1 granted patent·1 pending application·110 citations·filing 1999–2007
53Inventor score
Technology areasC08G
Top patents by PatentIndex Score
2 records- 0193US6221978B1Moisture curable hot melt adhesive and method for bonding substrates using sameHENKEL CORP·Filed 1999·Granted Apr 24, 2001·110 cites·110 claims
- 0245US2008223519A1Polyamide polyols and polyurethanes, methods for making and using, and products made therefromLOCKO GEORGE A·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →