Inventor · disambiguated record
Jonghyeon Chang
Also filed as: CHANG JONGHYEON
2 granted patents·3 pending applications·0 citations·filing 2022–2024
22Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0155US2025219020A1Method of manufacturing semiconductor package by using carrier substrateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0254US2025349770A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0353US2025120009A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0444US12506100B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 0541US12205832B2Substrate debonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →