Inventor · disambiguated record
John Davlin
Also filed as: DAVLIN JOHN · DAVLIN JOHN T
11 granted patents·5 pending applications·109 citations·filing 1998–2006
90Inventor score
Top patents by PatentIndex Score
16 records- 0185US6680078B2Method for dispensing flowable substances on microelectronic substratesMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 20, 2004·35 cites·70 claims
- 0268US6784120B2Method for pretreating a substrate prior to application of a polymeric coatMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 31, 2004·11 cites·22 claims
- 0361US6221157B1Spin coating bowl exhaust systemMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 24, 2001·19 cites·10 claims
- 0459US6946407B2Method for pretreating a substrate prior to application of a polymeric coatMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 20, 2005·6 cites·33 claims
- 0559US6559072B2Develop processing method of a resist surface of a substrate for reduced processing time and reduced defect densityMICRON TECHNOLOGY INC·Filed 2001·Granted May 6, 2003·5 cites·28 claims
- 0655US6461983B1Method for pretreating a substrate prior to application of a polymeric coatMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 8, 2002·17 cites·15 claims
- 0749US2007004221A1Methods for forming material layers with substantially planar surfaces on semiconductor device structuresWHITMAN JOHN·Filed 2006·Application pending·0 cites
- 0849US2007004219A1Semiconductor device fabrication methods employing substantially planar buffer material layers to improve the planarity of subsequent planarazation processesWHITMAN JOHN·Filed 2006·Application pending·0 cites
- 0946US6132802AMethods for exhausting a wafer coating apparatusMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 17, 2000·8 cites·23 claims
- 1045US7202138B2Spin coating for maximum fill characteristic yielding a planarized thin film surfaceMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 10, 2007·1 cites·35 claims
- 1143US6162294ASpin coating bowl exhaust systemMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 19, 2000·7 cites·19 claims
- 1240US6806209B2Develop processing method of a resist surface on a substrate for reduced processing time and reduced defect densityMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 19, 2004·0 cites·42 claims
- 1339US7101771B2Spin coating for maximum fill characteristic yielding a planarized thin film surfaceMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 5, 2006·0 cites·22 claims
- 1439US2004146648A1Method for dispensing flowable substances on microelectronic substratesFiled 2003·Application pending·0 cites
- 1537US2002005539A1Spin coating for maximum fill characteristic yielding a planarized thin film surfaceFiled 2001·Application pending·0 cites
- 1634US2003084852A1Temperature control elements, spindle assembly, and wafer processing assembly incorporating sameFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →