Inventor · disambiguated record
John H. Detrick
Also filed as: DETRICK JOHN H
9 granted patents·2 pending applications·370 citations·filing 1987–2004
92Inventor score
Files withRLC TECHNOLOGIES LLC7MELAMINE CHEMICALS INC1PURSELL IND1PURSELL IND INC1PURSELL TECHNOLOGIES INC1
Top patents by PatentIndex Score
11 records- 0194US6682751B1Controlled-release pesticidal composition and method of makingRLC TECHNOLOGIES LLC·Filed 2001·Granted Jan 27, 2004·45 cites·14 claims
- 0291US5599374AProcess for producing improved sulfur-coated urea slow release fertilizersRLC TECHNOLOGIES LLC·Filed 1994·Granted Feb 4, 1997·71 cites·8 claims
- 0388US5547486AMachine system and process for producing attrition resistant slow release fertilizersRLC TECHNOLOGIES LLC·Filed 1994·Granted Aug 20, 1996·54 cites·12 claims
- 0487US6338746B1Polymer-sulfur-polymer coated fertilizersRLC TECHNOLOGIES LLC·Filed 1999·Granted Jan 15, 2002·62 cites·10 claims
- 0587US5374292AMachine system and process for producing attrition resistant slow release fertilizersPURSELL IND·Filed 1993·Granted Dec 20, 1994·54 cites·5 claims
- 0674US6180565B1Micro-sized weed and feed particles having enhanced propertiesPURSELL IND INC·Filed 1996·Granted Jan 30, 2001·25 cites·8 claims
- 0773US5858094AMachine system and process for producing attrition resistant slow release fertilizersRLC TECHNOLOGIES LLC·Filed 1996·Granted Jan 12, 1999·28 cites·3 claims
- 0861US5125952AStorage-stable melamine dispersionMELAMINE CHEMICALS INC·Filed 1987·Granted Jun 30, 1992·20 cites·19 claims
- 0953US6537611B1Machine system and process for producing attrition resistant slow release fertilizersRLC TECHNOLOGIES LLC·Filed 1998·Granted Mar 25, 2003·11 cites·5 claims
- 1053US2004105877A1Controlled release pesticidal composition and method of makingRLC TECHNOLOGIES LLC·Filed 2003·Application pending·0 cites
- 1138US2005246066A1Method of predicting fertilizer performancePURSELL TECHNOLOGIES INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →