Inventor · disambiguated record
Joseph F. Dickson
Also filed as: DICKSON JOSEPH F
6 granted patents·166 citations·filing 1984–1997
85Inventor score
Top patents by PatentIndex Score
6 records- 0186US4563383ADirect bond copper ceramic substrate for electronic applicationsGEN ELECTRIC·Filed 1984·Granted Jan 7, 1986·74 cites·10 claims
- 0261US6056186AMethod for bonding a ceramic to a metal with a copper-containing shimBRUSH WELLMAN·Filed 1997·Granted May 2, 2000·33 cites·19 claims
- 0353US4563890ACut-off style, roll thread flat diesLITTON INDUSTRIAL PRODUCTS·Filed 1984·Granted Jan 14, 1986·13 cites·7 claims
- 0448US5182937ASeam-free thread rolling diesQUAMCO INC·Filed 1991·Granted Feb 2, 1993·14 cites·8 claims
- 0547US5760473ASemiconductor package having a eutectic bonding layerBRUSH WELLMAN·Filed 1996·Granted Jun 2, 1998·18 cites·18 claims
- 0647US5243843AThread forming method and apparatusQUAMCO INC·Filed 1992·Granted Sep 14, 1993·14 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →