Inventor · disambiguated record
John Ditri
Also filed as: DITRI JOHN · DITRI JOHN J
17 granted patents·1 pending application·180 citations·filing 1996–2021
93Inventor score
Top patents by PatentIndex Score
18 records- 0196US10306802B1Micro jet impingement heat sinkLOCKHEED CORP·Filed 2015·Granted May 28, 2019·41 cites·19 claims
- 0291US8780556B1Fluid actuated cooling card retainerDITRI JOHN·Filed 2012·Granted Jul 15, 2014·21 cites·15 claims
- 0389US11691214B2Ultrasound hornSHINKAWA KK·Filed 2021·Granted Jul 4, 2023·4 cites·26 claims
- 0487US9659838B1Integration of chip level micro-fluidic cooling in chip packages for heat flux removalLOCKHEED CORP·Filed 2016·Granted May 23, 2017·5 cites·11 claims
- 0580US9423154B1Solar heat collecting element having an edge welded bellows assemblyVELASCO DAVID·Filed 2010·Granted Aug 23, 2016·6 cites·19 claims
- 0680US5734588ABore probe for tube inspection with guided waves and method thereforPENN STATE RES FOUND·Filed 1996·Granted Mar 31, 1998·66 cites·13 claims
- 0779US10602635B2Two-phase fluid-actuated cooling device, system, and methodLOCKHEED CORP·Filed 2018·Granted Mar 24, 2020·3 cites·15 claims
- 0878US10211127B1Integration of chip level micro-fluidic cooling in chip packages for heat flux removalLOCKHEED CORP·Filed 2017·Granted Feb 19, 2019·2 cites·13 claims
- 0974US6412683B1Cornercube offset toolKULICKE & SOFFA INVESTMENTS·Filed 2001·Granted Jul 2, 2002·13 cites·39 claims
- 1072US8963645B1Integrated-circuit amplifier with low temperature riseLOCKHEED CORP·Filed 2012·Granted Feb 24, 2015·3 cites·19 claims
- 1170US8881721B2Solar receiver diaphragmMORBER JOHN J·Filed 2011·Granted Nov 11, 2014·4 cites·8 claims
- 1269US8466747B1Integrated-circuit amplifier with low temperature riseHELMS DAVID R·Filed 2011·Granted Jun 18, 2013·3 cites·11 claims
- 1365US9719694B1Solar heat collecting element having an edge welded bellows assemblyVELASCO DAVID·Filed 2011·Granted Aug 1, 2017·1 cites·19 claims
- 1465US8302596B1Robust glass to metal sealing jointVELASCO DAVID·Filed 2009·Granted Nov 6, 2012·3 cites·5 claims
- 1554US2019181071A1Integration of chip level micro-fluidic cooling in chip packages for heat flux removalLOCKHEED CORP·Filed 2019·Application pending·0 cites
- 1648US6520400B2Wire tensioning apparatusKULICKE & SOFFA INVESTMENTS·Filed 2001·Granted Feb 18, 2003·3 cites·23 claims
- 1746US6712257B2Indirect imaging method for a bonding toolKULICKE & SOFFA INVESTMENTS·Filed 2002·Granted Mar 30, 2004·1 cites·4 claims
- 1846US6641026B2Indirect imaging system for a bonding toolKULICKE & SOFFA INVESTMENTS·Filed 2002·Granted Nov 4, 2003·1 cites·36 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →