Inventor · disambiguated record
Joseph D’Silva
Also filed as: D’SILVA JOSEPH
0 granted patents·23 pending applications·0 citations·filing 2023–2025
Files withINTEL CORP23
Top patents by PatentIndex Score
23 records- 0165US2025221041A1Integrated circuit structure with front-side-guided backside source or drain contactINTEL CORP·Filed 2023·Application pending·0 cites
- 0263US2025228008A1Integrated circuit structure with front-side-guided backside source or drain contactINTEL CORP·Filed 2025·Application pending·0 cites
- 0360US2025309115A1Integrated circuit structures having staggered backside interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 0457US2025311329A1Integrated circuit structures having bidirectional backside interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 0556US2025311296A1Integrated circuit structure with direct backside source or drain contact and reduced gate depthINTEL CORP·Filed 2024·Application pending·0 cites
- 0656US2025309131A1Integrated circuit structure with backside source or drain contact selectivity using colored hardmasksINTEL CORP·Filed 2024·Application pending·0 cites
- 0755US2024332175A1Backside transistor contact surrounded by oxideINTEL CORP·Filed 2023·Application pending·0 cites
- 0855US2025218869A1Self-aligned back-side gate viasINTEL CORP·Filed 2023·Application pending·0 cites
- 0955US2025107183A1Integrated circuit structure with differentiated source or drain structuresINTEL CORP·Filed 2023·Application pending·0 cites
- 1055US2025218937A1Directed self assembly-enabled back-side contact arrays aligned to gate electrodesINTEL CORP·Filed 2023·Application pending·0 cites
- 1155US2025221020A1Double-sided device contacts and through vias for performance and layout benefitsINTEL CORP·Filed 2023·Application pending·0 cites
- 1254US2025221040A1Integrated circuit structure with front-side-cut backside source or drain contactINTEL CORP·Filed 2023·Application pending·0 cites
- 1353US2025220991A1Integrated circuit structure with direct backside source or drain contactINTEL CORP·Filed 2023·Application pending·0 cites
- 1453US2024405085A1Integrated circuit structure with backside contact stitchingINTEL CORP·Filed 2023·Application pending·0 cites
- 1552US2025220978A1Integrated circuit structure with asymmetric epitaxial source or drain arrangementsINTEL CORP·Filed 2023·Application pending·0 cites
- 1652US2024421153A1Integrated circuit structure with backside contact reveal uniformityINTEL CORP·Filed 2023·Application pending·0 cites
- 1752US2024421101A1Backside contact based die edge guard ringsINTEL CORP·Filed 2023·Application pending·0 cites
- 1852US2024429291A1Integrated circuit structure with backside source or drain contact selectivityINTEL CORP·Filed 2023·Application pending·0 cites
- 1952US2025006568A1Integrated circuit structures having alternative carriers for dual-sided devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 2051US2024332064A1Back side interconnect patterning and front side metal interconnect on a transistor layerINTEL CORP·Filed 2023·Application pending·0 cites
- 2151US2024313096A1Integrated circuit structure with back-side contact selectivityINTEL CORP·Filed 2023·Application pending·0 cites
- 2250US2024332172A1Integrated circuit structure with backside contact wideningINTEL CORP·Filed 2023·Application pending·0 cites
- 2348US2024332302A1Integrated circuit structures with backside conductive source or drain contact having enhanced contact areaINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →