Inventor · disambiguated record
Joanna Dziewiszek
Also filed as: DZIEWISZEK JOANNA · DZIEWISZEK JOANNA J
6 granted patents·1 pending application·3 citations·filing 2016–2023
68Inventor score
Files withROHM & HAAS ELECT MAT7
Top patents by PatentIndex Score
7 records- 0171US10508357B2Method of filling through-holes to reduce voids and other defectsROHM & HAAS ELECT MAT·Filed 2016·Granted Dec 17, 2019·2 cites·5 claims
- 0262US9932684B2Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxidesROHM & HAAS ELECT MAT·Filed 2016·Granted Apr 3, 2018·1 cites·8 claims
- 0348US2023279577A1Method of filling through-holes to reduce voidsROHM & HAAS ELECT MAT·Filed 2023·Application pending·0 cites
- 0443US10508349B2Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxidesROHM & HAAS ELECT MAT·Filed 2017·Granted Dec 17, 2019·0 cites·10 claims
- 0541US10190228B2Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined featuresROHM & HAAS ELECT MAT·Filed 2017·Granted Jan 29, 2019·0 cites·8 claims
- 0640US10100421B2Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compoundsROHM & HAAS ELECT MAT·Filed 2016·Granted Oct 16, 2018·0 cites·8 claims
- 0740US10104782B2Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxidesROHM & HAAS ELECT MAT·Filed 2016·Granted Oct 16, 2018·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →