Inventor · disambiguated record
Jooyang Eom
Also filed as: EOM JOOYANG
8 granted patents·7 pending applications·4 citations·filing 2019–2025
78Inventor score
Technology areasH10W
Files withSEMICONDUCTOR COMPONENTS IND LLC15
Top patents by PatentIndex Score
15 records- 0191US11984424B2Semiconductor packages using package in package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 0290US11430777B2Power module package for direct cooling multiple power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 30, 2022·2 cites·16 claims
- 0382US12417999B2Semiconductor packages using package in package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Sep 16, 2025·0 cites·20 claims
- 0482US12308364B2Power module package for direct cooling multiple power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 0582US2025279405A1Power module package for direct cooling multiple power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0677US11848320B2Power module package for direct cooling multiple power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 0775US2025125297A1Submodule semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0871US12205918B2Submodule semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 0970US2024186211A1Direct-cooling for semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1068US12230601B2High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 1166US2025192097A1High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1263US2022173022A1Clips for semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
- 1360US11264311B2Clips for semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 1, 2022·0 cites·20 claims
- 1457US2022157688A1Direct-cooling for semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Application pending·0 cites
- 1557US2025105164A1Leadframe-less semiconductor device assemblies with dual-sided coolingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →