Inventor · disambiguated record
John C. Estes
Also filed as: ESTES JOHN · ESTES JOHN C
11 granted patents·1 pending application·225 citations·filing 1995–2008
90Inventor score
Top patents by PatentIndex Score
12 records- 0185US5818313AMultilayer lowpass filter with single point ground plane configurationMOTOROLA INC·Filed 1997·Granted Oct 6, 1998·48 cites·10 claims
- 0284US6664935B1Broad band impedance matching device with coupled transmission linesMOTOROLA INC·Filed 2002·Granted Dec 16, 2003·23 cites·35 claims
- 0384US5584053ACommonly coupled high frequency transmitting/receiving switching moduleMOTOROLA INC·Filed 1995·Granted Dec 10, 1996·82 cites·21 claims
- 0483US6289204B1Integration of a receiver front-end in multilayer ceramic integrated circuit technologyMOTOROLA INC·Filed 1998·Granted Sep 11, 2001·47 cites·5 claims
- 0572US8159314B1Actively tuned filterESTES JOHN C·Filed 2008·Granted Apr 17, 2012·7 cites·15 claims
- 0661US7528686B1Tunable filter utilizing a conductive gridROCKWELL COLLINS INC·Filed 2007·Granted May 5, 2009·2 cites·18 claims
- 0756US7221244B2Localized enhancement of multilayer substrate thickness for high Q RF componentsMOTOROLA INC·Filed 2005·Granted May 22, 2007·1 cites·13 claims
- 0854US6664606B2Multi-layer integrated circuit structure with reduced magnetic couplingMOTOROLA INC·Filed 2002·Granted Dec 16, 2003·6 cites·9 claims
- 0953US6803836B2Multilayer ceramic package transmission line probeFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Oct 12, 2004·4 cites·18 claims
- 1053US6653911B2Broad band impedance matching device with reduced line widthMOTOROLA INC·Filed 2002·Granted Nov 25, 2003·3 cites·25 claims
- 1148US6971162B2Localized enhancement of multilayer substrate thickness for high Q RF componentsMOTOROLA INC·Filed 2003·Granted Dec 6, 2005·2 cites·8 claims
- 1237US2006091981A1Method and system for frequency trimmingMOTOROLA INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →