Inventor · disambiguated record
Johannes Etzkorn
Also filed as: ETZKORN JOHANNES
3 granted patents·2 pending applications·5 citations·filing 2006–2014
54Inventor score
Top patents by PatentIndex Score
5 records- 0171US8042726B2Method for bonding work pieces made of stainless steel, nickel or nickel alloys, using a bonding layer consisting of nickel-phosphorous, method for producing a micro-structured component using such method; micro-structured component obtained by such methodATOTECH DEUTSCHLAND GMBH·Filed 2007·Granted Oct 25, 2011·5 cites·21 claims
- 0250US2008217381A1Method for Bonding Work pieces and Micro-Structured ComponentATOTECH DEUTSCHLAND GMBH·Filed 2006·Application pending·0 cites
- 0346US2016273112A1Electroless copper plating solutionATOTECH DEUTSCHLAND GMBH·Filed 2014·Application pending·0 cites
- 0439US9650718B2Electroless copper plating solutionATOTECH DEUTSCHLAND GMBH·Filed 2014·Granted May 16, 2017·0 cites·19 claims
- 0536US9822034B2Method for electroless platingBRÜNING FRANK·Filed 2012·Granted Nov 21, 2017·0 cites·7 claims
Join the waitlist — get patent alerts
Get an alert when Johannes Etzkorn files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →