Inventor · disambiguated record
Jon T. Ewanich
Also filed as: EWANICH JON · EWANICH JON T
7 granted patents·326 citations·filing 1987–2013
89Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0190US8476129B1Method and structure of sensors and MEMS devices using vertical mounting with interconnectionsJENSEN DAVE PAUL·Filed 2011·Granted Jul 2, 2013·23 cites·13 claims
- 0287US8981560B2Method and structure of sensors and MEMS devices using vertical mounting with interconnectionsMCUBE INC·Filed 2013·Granted Mar 17, 2015·9 cites·11 claims
- 0384US4769272ACeramic lid hermetic seal package structureNAT SEMICONDUCTOR CORP·Filed 1987·Granted Sep 6, 1988·81 cites·5 claims
- 0483US6093029AVertically stackable integrated circuitS3 INC·Filed 1998·Granted Jul 25, 2000·88 cites·14 claims
- 0578US5008734AStadium-stepped package for an integrated circuit with air dielectricNAT SEMICONDUCTOR CORP·Filed 1989·Granted Apr 16, 1991·55 cites·16 claims
- 0669US4833102AProcess of making a ceramic lid for use in a hermetic seal packageNAT SEMICONDUCTOR CORP·Filed 1988·Granted May 23, 1989·40 cites·9 claims
- 0758US5159750AMethod of connecting an IC component with another electrical componentNAT SEMICONDUCTOR CORP·Filed 1991·Granted Nov 3, 1992·30 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Jon T. Ewanich files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →