Inventor · disambiguated record
Joseph Fernandez
Also filed as: FERNANDEZ JOSEPH · FERNANDEZ JOSEPH D
12 granted patents·6 pending applications·274 citations·filing 1997–2018
93Inventor score
Top patents by PatentIndex Score
18 records- 0184US7326594B2Connecting a plurality of bond pads and/or inner leads with a single bond wireMICROCHIP TECH INC·Filed 2006·Granted Feb 5, 2008·17 cites·16 claims
- 0281US5909050ACombination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method thereforMICROCHIP TECH INC·Filed 1997·Granted Jun 1, 1999·59 cites·18 claims
- 0380US9630352B2Open cavity plastic packageMICROCHIP TECH INC·Filed 2016·Granted Apr 25, 2017·4 cites·20 claims
- 0480US6306684B1Stress reducing lead-frame for plastic encapsulationMICROCHIP TECH INC·Filed 2000·Granted Oct 23, 2001·37 cites·32 claims
- 0579US6180433B1Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method thereforMICROCHIP TECH INC·Filed 1999·Granted Jan 30, 2001·53 cites·20 claims
- 0675US6333549B2Integrated circuit package having interchip bonding and method thereforMICROCHIP TECH INC·Filed 2000·Granted Dec 25, 2001·26 cites·20 claims
- 0766US9269597B2Open cavity plastic packageMICROCHIP TECH INC·Filed 2014·Granted Feb 23, 2016·2 cites·12 claims
- 0866US7110980B2System and method for facilitating electronic transfer of fundsAMERICAN EXPRESS BANK LTD·Filed 2003·Granted Sep 19, 2006·13 cites·20 claims
- 0962US6139676AApparatus and method for removing semiconductor chips from a diced semiconductor waferMICROCHIP TECH INC·Filed 1997·Granted Oct 31, 2000·27 cites·16 claims
- 1051US7157790B2Single die stitch bondingMICROCHIP TECH INC·Filed 2002·Granted Jan 2, 2007·7 cites·14 claims
- 1151US6159765AIntegrated circuit package having interchip bonding and method thereforMICROCHIP TECH INC·Filed 1998·Granted Dec 12, 2000·18 cites·7 claims
- 1245US2006277143A1System and method for facilitating electronic transfer of fundsAMERICAN EXPRESS BANK LTD·Filed 2006·Application pending·0 cites
- 1345US2008099893A1Connecting a plurality of bond pads and/or inner leads with a single bond wireMICROCHIP TECH INC·Filed 2007·Application pending·0 cites
- 1443US6245597B1Method for reducing die cracking in integrated circuitsMICROCHIP TECH INC·Filed 1999·Granted Jun 12, 2001·11 cites·14 claims
- 1533US2015187688A1Method For Treating A Leadframe Surface And Device Having A Treated Leadframe SurfaceMICROCHIP TECH INC·Filed 2014·Application pending·0 cites
- 1631US2014069463A1Particle detection and cleaning systemCOYNE JAMES·Filed 2012·Application pending·0 cites
- 1730US2019221502A1Down Bond in Semiconductor DevicesMICROCHIP TECH INC·Filed 2018·Application pending·0 cites
- 1829US2002145190A1Arrangement and method of arrangement of stacked dice in an integrated electronic deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →