Inventor · disambiguated record
John A. Forthun
Also filed as: FORTHUN JOHN A · FORTHUN JOHN ARTHUR
8 granted patents·1 pending application·1,238 citations·filing 1995–2004
92Inventor score
Technology areasH10W
Files withDENSE PAC MICROSYSTEMS INC3DPAC TECHNOLOGIES CORP1ENTORIAN TECHNOLOGIES LP1STAKTEK GROUP LP1
Top patents by PatentIndex Score
9 records- 0197US5612570AChip stack and method of making sameDENSE PAC MICROSYSTEMS INC·Filed 1995·Granted Mar 18, 1997·341 cites·18 claims
- 0296US6262895B1Stackable chip package with flex carrierFiled 2000·Granted Jul 17, 2001·219 cites·15 claims
- 0395US6473308B2Stackable chip package with flex carrierFiled 2001·Granted Oct 29, 2002·125 cites·4 claims
- 0491US6660561B2Method of assembling a stackable integrated circuit chipDPAC TECHNOLOGIES CORP·Filed 2002·Granted Dec 9, 2003·74 cites·6 claims
- 0591US6627984B2Chip stack with differing chip package typesDENSE PAC MICROSYSTEMS INC·Filed 2001·Granted Sep 30, 2003·101 cites·15 claims
- 0691US5869353AModular panel stacking processDENSE PAC MICROSYSTEMS INC·Filed 1997·Granted Feb 9, 1999·298 cites·6 claims
- 0790US6908792B2Chip stack with differing chip package typesSTAKTEK GROUP LP·Filed 2002·Granted Jun 21, 2005·78 cites·5 claims
- 0848USRE41039EStackable chip package with flex carrierENTORIAN TECHNOLOGIES LP·Filed 2004·Granted Dec 15, 2009·2 cites·8 claims
- 0934US2002089831A1Module with one side stacked memoryFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →