Inventor · disambiguated record
John K. Frei
Also filed as: FREI JOHN · FREI JOHN K
7 granted patents·3 pending applications·313 citations·filing 1991–2015
88Inventor score
Top patents by PatentIndex Score
10 records- 0191US5342999AApparatus for adapting semiconductor die pads and method thereforMOTOROLA INC·Filed 1992·Granted Aug 30, 1994·169 cites·9 claims
- 0269US5345056APlasma based soldering by indirect heatingMOTOROLA INC·Filed 1991·Granted Sep 6, 1994·48 cites·24 claims
- 0365US5406034ACircuit board having stepped viasMOTOROLA INC·Filed 1994·Granted Apr 11, 1995·30 cites·16 claims
- 0456US5401689AMethod for forming a semiconductor chip carrierMOTOROLA INC·Filed 1994·Granted Mar 28, 1995·24 cites·12 claims
- 0549US5223691APlasma based soldering method requiring no additional heat sources or fluxMOTOROLA INC·Filed 1991·Granted Jun 29, 1993·16 cites·40 claims
- 0648US5296736ALeveled non-coplanar semiconductor die contactsMOTOROLA INC·Filed 1992·Granted Mar 22, 1994·20 cites·16 claims
- 0748US2012330643A1System and method for translationFREI JOHN·Filed 2012·Application pending·0 cites
- 0843US2015149149A1System and method for translationSPEECHTRANS INC·Filed 2015·Application pending·0 cites
- 0937US2012046933A1System and Method for TranslationFREI JOHN·Filed 2011·Application pending·0 cites
- 1034US5341115AReinforced wrap around ground and methodMOTOROLA INC·Filed 1992·Granted Aug 23, 1994·6 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →