Inventor · disambiguated record
Joji Fujimori
Also filed as: FUJIMORI JOJI
8 granted patents·1 pending application·289 citations·filing 1996–2013
87Inventor score
Top patents by PatentIndex Score
9 records- 0192US8564121B2Semiconductor device and manufacturing method of semiconductor deviceIHARA TAKUMI·Filed 2011·Granted Oct 22, 2013·15 cites·16 claims
- 0292US6218281B1Semiconductor device with flip chip bonding pads and manufacture thereofFUJITSU LTD·Filed 1998·Granted Apr 17, 2001·162 cites·29 claims
- 0381US5831441ATest board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor deviceFUJITSU LTD·Filed 1996·Granted Nov 3, 1998·58 cites·2 claims
- 0479US6689639B2Method of making semiconductor deviceFUJITSU LTD·Filed 2002·Granted Feb 10, 2004·30 cites·27 claims
- 0577US6897142B2Formation of solder balls having resin member as reinforcementFUJITSU LTD·Filed 2003·Granted May 24, 2005·21 cites·12 claims
- 0664US7871917B2Semiconductor device and manufacturing method for the sameFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Jan 18, 2011·3 cites·14 claims
- 0752US9425088B2Manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted Aug 23, 2016·0 cites·12 claims
- 0850US2010105173A1Method of producing semiconductor device provided with flip-chip mounted semiconductor elementFUJITSU MICROELECTRONICS LTD·Filed 2009·Application pending·0 cites
- 0944US7879713B2Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrodeFUJITSU SEMICONDUCTOR LTD·Filed 2007·Granted Feb 1, 2011·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →