Inventor · disambiguated record
Josef Gaida
Also filed as: GAIDA JOSEF
8 granted patents·1 pending application·6 citations·filing 2007–2021
76Inventor score
Files withATOTECH DEUTSCHLAND GMBH5UHLIG ALBRECHT2ATOTECH DEUTSCHLAND GMBH & CO KG1BARTHELMES JÜRGEN1
Top patents by PatentIndex Score
9 records- 0171US10619251B2Etching solution for copper and copper alloy surfacesATOTECH DEUTSCHLAND GMBH·Filed 2016·Granted Apr 14, 2020·1 cites·16 claims
- 0270US11035051B2Acidic aqueous composition for electrolytic copper platingATOTECH DEUTSCHLAND GMBH·Filed 2017·Granted Jun 15, 2021·1 cites·13 claims
- 0363US12071702B2Acidic aqueous composition for electrolytic copper platingATOTECH DEUTSCHLAND GMBH·Filed 2021·Granted Aug 27, 2024·0 cites·2 claims
- 0460US9076773B2Wire bondable surface for microelectronic devicesUHLIG ALBRECHT·Filed 2012·Granted Jul 7, 2015·2 cites·2 claims
- 0554US11091849B2Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloyATOTECH DEUTSCHLAND GMBH·Filed 2018·Granted Aug 17, 2021·0 cites·9 claims
- 0653US8986789B2Stress-reduced Ni-P/Pd stacks for bondable wafer surfacesUHLIG ALBRECHT·Filed 2009·Granted Mar 24, 2015·2 cites·6 claims
- 0749US12054843B2Acidic aqueous composition for electrolytically depositing a copper depositATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2021·Granted Aug 6, 2024·0 cites·9 claims
- 0849US2022154343A1A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallizationATOTECH DEUTSCHLAND GMBH·Filed 2020·Application pending·0 cites
- 0941US9057145B2Electrodeposition method with analysis of the electrolytic bath by solid phase extractionBARTHELMES JÜRGEN·Filed 2007·Granted Jun 16, 2015·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →