Inventor · disambiguated record
Johann Gatterbauer
Also filed as: GATTERBAUER JOHANN
19 granted patents·1 pending application·25 citations·filing 2012–2024
90Inventor score
Top patents by PatentIndex Score
20 records- 0185US9502248B1Methods for making a semiconductor chip deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 22, 2016·5 cites·18 claims
- 0285US8765531B2Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangementGATTERBAUER JOHANN·Filed 2012·Granted Jul 1, 2014·11 cites·23 claims
- 0380US12040288B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 0480US10978418B2Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layerINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 0578US10461056B2Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 29, 2019·2 cites·7 claims
- 0677US2024371796A1Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0775US9875978B2Semiconductor chip deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 23, 2018·2 cites·17 claims
- 0875US9082626B2Conductive pads and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 14, 2015·3 cites·19 claims
- 0971US11735534B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 1068US12033972B2Chip package, method of forming a chip package and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 9, 2024·0 cites·12 claims
- 1163US10607972B2Semiconductor devices for integration with light emitting chips and modules thereofINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 31, 2020·0 cites·14 claims
- 1256US9966368B2Semiconductor devices for integration with light emitting chips and modules thereofINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 8, 2018·0 cites·18 claims
- 1354US9704839B2Semiconductor devices for integration with light emitting chips and modules thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 11, 2017·0 cites·27 claims
- 1452US10049994B2Contact pads with sidewall spacers and method of making contact pads with sidewall spacersINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 14, 2018·0 cites·23 claims
- 1549US11424201B2Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic deviceINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 23, 2022·0 cites·13 claims
- 1649US8822327B2Contact pads with sidewall spacers and method of making contact pads with sidewall spacersGATTERBAUER JOHANN·Filed 2012·Granted Sep 2, 2014·0 cites·10 claims
- 1748US9362216B2Conductive pads and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jun 7, 2016·0 cites·22 claims
- 1844US11328935B2Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 10, 2022·0 cites·15 claims
- 1944US8736062B2Pad sidewall spacers and method of making pad sidewall spacersGATTERBAUER JOHANN·Filed 2012·Granted May 27, 2014·0 cites·23 claims
- 2043US11127693B2Barrier for power metallization in semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →