Inventor · disambiguated record
John Geile
Also filed as: GEILE JOHN
4 granted patents·9 pending applications·4 citations·filing 2017–2022
63Inventor score
Top patents by PatentIndex Score
13 records- 0185US11225022B2Build material dispensing deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jan 18, 2022·3 cites·20 claims
- 0277US11254056B2Feeding mechanisms for 3D printersHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Feb 22, 2022·1 cites·15 claims
- 0376US11607849B2Build material dispensing deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Mar 21, 2023·0 cites·20 claims
- 0467US2022134665A1Feeding mechanisms for 3d printersHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Application pending·0 cites
- 0561US12446660B2Fluid distributors and foot support systems including fluid movement controllers and adjustable foot support pressureNIKE INC·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 0656US2025325721A1System and device for reducing microbial burden on a surfaceSTERIFRE MEDICAL INC·Filed 2022·Application pending·0 cites
- 0749US2021362423A1Moisture content adjustments in build material transport pathsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 0846US2021276266A1Additive manufacturing temperature controlHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 0944US2021206087A1Three-dimensional printerHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 1040US2021206085A1Build material dispenser refill control for additive manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 1140US2021197482A1PrintersHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 1238US2021206088A13d print material shut-offHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 1331US2021206077A1Lid of a build material carriage of a three-dimensional (3d) printerHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →